Nepes Expands IC Packaging Capabilities for the 3D-IC era with Advanced Design Flows from Siemens
March 8, 2024 | SiemensEstimated reading time: 1 minute

Siemens Digital Industries Software announced that South Korea-based nepes corporation, a global leader in Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of industry-leading solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D-IC packages.
“nepes is committed to providing us with the most comprehensive portfolio of semiconductor packaging design and manufacturing services, to help us innovate and succeed in a market where high performance and compact form factors are critical.” said Brad Seo, vice president of SAPEON Korea’s R&D center. “By expanding nepes’ adoption and usage of Siemens’ EDA technologies for advanced packaging, we also can achieve the innovative technologies necessary to grow.”
nepes has an established track record of providing customers with world-class packaging, testing, and semiconductor assembly services for clients throughout the global electronics industry. nepes also offers packaging design services including wafer level packaging, fan-out wafer level packages, and panel level packaging.
Building on this foundation, nepes is now driving additional packaging innovation with a broad range of advanced technologies from Siemens EDA, including the Calibre® nmPlatform, which includes Calibre® 3DSTACK software, HyperLynx™ software for electrical rule checking, as well as Siemens’ industry-leading Xpedition™ Substrate Integrator software and Xpedition™ Package Designer software. Together, these Siemens technologies helped nepes provide fast and reliable design services including 2.5D/3D-based chiplet designs for the company’s growing base of global IC customers.
“Siemens is committed to delivering industry-leading semiconductor packaging technologies to supply chain partners such as nepes, which helps enable them to achieve their digitalization goals,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “As an existing partner and supplier to nepes we are pleased to extend this relationship for the advantage of our mutual customers.”
Suggested Items
Xanadu Opens $10M Advanced Photonic Packaging Facility in Ontario
06/25/2025 | PRNewswireXanadu, a world leader in photonic quantum computing, has opened a $10M world-leading advanced photonic packaging facility in Toronto. This facility represents a significant leap in Canada's quantum supply chain resilience and technical capacity.
KYZEN to Feature MICRONOX Semiconductor Grade Cleaning Chemistries at CHIPcon 2025
06/24/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the CHIPLET and Heterogeneous Integration Packaging Conference and Exhibition, or CHIPcon, scheduled to take place July 7-10 at the San Jose Marriott
NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials
06/18/2025 | NHanced SemiconductorsAt the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements
06/12/2025 | SEMIThe MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.