NHanced Semiconductors VP Charles Woychik to Deliver Keynote at SMTA’s Symposium on Counterfeit Parts & Materials

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At the upcoming SMTA Symposium on Counterfeit Parts & Materials, NHanced Semiconductors vice-president Dr. Charles Woychik will deliver a keynote address detailing the critical role of advanced packaging technologies needed to build a more resilient and advanced Outsourced Assembly and Test (OSAT) sector in the U.S. A strategic focus on advanced packaging technologies – such as 2.5D and 3D integration, wafer-level packaging, hybrid bonding, and chiplet architectures – are essential to position U.S. OSATs to compete with more established overseas OSATs, where lower labor costs, economies of scale, and existing infrastructure provide significant advantages.

In his address, Woychik will address the strategic focus necessary for U.S. OSATs to compete, including leveraging government support (CHIPS Act) to invest in new equipment, attract skilled talent, and foster innovation in both packaging and test methods. In addition, close collaboration between OSATs, Integrated Device Manufacturers (IDMs), and fabless semiconductor companies will be essential to align the latest advanced packaging technologies to address the performance, power, and density requirements of next-generation applications in AI, 5G, autonomous systems, and high-performance computing.

An example of such a U.S. OSAT is NHanced Semiconductors, the world’s first pure-play advanced packaging foundry. NHanced employs a revolutionary business model using advanced packaging technologies to advance the progress of Moore’s Law in today’s semiconductor industry. Known as Foundry 2.0, this model sources best-of-class components from traditional foundries and applies semiconductor foundry processes to combine them in novel and powerful assemblies. This manufacturing model is inherently different from today’s traditional foundries and OSATs.

The 2025 SMTA Symposium on Counterfeit Parts & Materials will be held at the College Park Marriot Conference Center in College Park, MD from June 24 - 26. The conference is organized by SMTA in conjunction with the University of Maryland’s Center for Advanced Life Cycle Engineering (CALCE) with the objective of raising awareness about the dangers and consequences of using counterfeit materials and to encourage the implementation of measures to prevent and mitigate the spread of counterfeit parts.