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We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Data I/O to Showcase Automated Pre-placement Device Programming and Security Provisioning Solutions for the Connected Factory at IPC APEX EXPO 2024
March 12, 2024 | Data I/O CorporationEstimated reading time: Less than a minute
Data I/O Corporation, the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will showcase device programming and security provisioning solutions delivering high-performance, configuration flexibility automated device programming systems with security provisioning and industry 4.0 integration capability to enable traceability, process analysis and two-way communication that improves factory efficiency and quality at the lowest total cost of ownership.
Data I/O will demonstrate a 64% increase in programming performance on Lumen®X Programmers with VerifyBoost™, the PSV family automated device programming systems, SentriX® security provisioning platform and the ConneX® software application that enables Data I/O’s device programming systems to integrate into the connected factory at the IPC APEX Expo in booth #3107 in Anaheim, California from April 9th – 11th at the Anaheim Convention Center.
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01/22/2025 | SIAFollowing this week’s inauguration of President Trump and Vice President Vance, the Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer welcoming the new administration.
Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
01/22/2025 | Cadence Design SystemsCadence announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider.
Lockheed Martin Delivers the First Aegis System Equipped Vessel AN/SPY-7(V)1 Radar Antenna to Japan Ministry of Defense
01/16/2025 | Lockheed MartinLockheed Martin successfully delivered the first AN/SPY-7(V)1 radar antenna for the Aegis System Equipped Vessel (ASEV) to the Japan Ministry of Defense.
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
01/16/2025 | SIAThe Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.