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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 14, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth, #3520, in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.
There is no shortage of show-related news in the cycle right now. Visit iconnect007.com to read the latest on everything related to this year’s IPC APEX EXPO. But that’s not all that’s going on, so I’ve picked up five key pieces of news that might otherwise get buried in the hullaballoo of the IPC show.
Unsurprisingly, they track right along with much of the mainstream media: tariffs, the global economy, and U.S. industrial investment. There will be lots of conversation on these themes when we convene in southern California next week, and these are the reports you should know to be informed. See you in Anaheim.
Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade
Published March 7
In a statement attributed to Dr. John W. Mitchell, IPC president and CEO, the decision to postpone tariffs Mexican and Canadian goods is applauded. The Canadian, Mexican, and U.S. electronics industries are so closely intertwined and Mitchell stresses that IPC is eager to work with the Trump administration to build a stronger industrial base. Read more here.
IPC Global Standards Driving Factory of the Future
Published March 10
Chris Jorgensen advocates that Factory of the Future amounts to a revolutionary shift in manufacturing and that IPC task groups strive to be at the forefront of this transformation. Click here to read the summary, and to follow the link to the entire article as published in the March 2025 issue of SMT007 Magazine.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
Published March 13
Well, we hate to see this, but Tom Forsythe has earned his retirement. Tom is responsible for much of KYZEN's success since he joined the firm in 1992. We've run into Tom at trade shows and conferences all over the world, and he always give a fantastic interview. We'll miss him, and we wish him all the best.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
Published March 13
John Watson has penned a great colum that compares the design data handoff to the passing of batons during the Olympic relays. As the U.S. relay team learned in 2020, mistakes made during the passing of the baton can snowball and lead to failure. If you're experiencing problems during design data handoff, you won't want to miss this column.
ICT Spring Seminar: Nickel Not Welcome Here
Published March 12
Our favorite road reporter Pete Starkey was in Tewkesbury earlier this month covering the ICT Spring Seminar, which highlighted the industry's shift away from nickel in PCB manufacturing. Experts discussed the environmental and performance benefits of alternative materials, emphasizing the need for sustainable practices. Pete has a way of drilling down to what's most important, and the key topics he covered included advancements in copper and silver-based technologies and the impact on product reliability and cost-effectiveness. I know you'll enjoy this read.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
07/15/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.
TRI Unveils New Platform for Diverse Board Sizes Search Submit
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.
Seeing a Future in Mexico
07/09/2025 | Michelle Te, I-Connect007The Global Electronics Association (formerly known as IPC) has been instrumental in fostering a partnership with Guanajuato, a state north of Mexico City with 12 industrial clusters and close to 150 companies involved in electronics. This past spring, Alejandro Hernández, the undersecretary for investment promotion in Guanajuato, attended IPC APEX EXPO 2025 at the invitation of IPC Mexico Director Lorena Villanueva, where he met with several companies to discuss the opportunities available in Mexico. He is inviting electronics-related companies seeking long-term investment in a centrally located area with access to highways, railways, and ports.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
IPC-CFX, 2.0: How to Use the QPL Effectively
07/02/2025 | Chris Jorgensen, Global Electronics AssociationIn part one of this series, we discussed the new features in CFX Version 2.0 and their implications for improved inter-machine communication. But what about bringing this new functionality to the shop floor? The IPC-CFX-2591 QPL is a powerful technical resource for manufacturers seeking CFX-enabled equipment. The Qualified Product List (QPL) helps streamline equipment selection by listing models verified for CFX compliance through a robust third-party virtual qualification process.