DARPA Explores Additive Manufacturing’s Revolutionary Potential for Futuristic Microsystems
March 12, 2024 | DARPAEstimated reading time: 2 minutes

DARPA played a seminal role in establishing materials science as a discipline. One of the latest disruptive efforts in new materials and applications, the Additive Manufacturing of Microelectronic systEms (AMME) program, seeks to launch microsystems manufacturing far beyond today’s state of the art.
AMME takes aim at revolutionizing the manufacture of microsystems through technological breakthroughs in producing novel, multi-material microsystems at incredible speeds, volumes, and resolution. This additive manufacturing process would enhance commercial devices with innovative add-on technologies and create the ability to rapidly respond to mission requirements – innovations similar to additive manufacturing’s transformation of complex prototyping. With AMME, DARPA aims to overcome fundamental limits specifically for microsystems.
DARPA seeks groundbreaking advances in additive manufacturing by achieving a trifecta of material quality, high resolution, and massive print throughput. The goal of AMME will be to make it possible to create microsystems with new geometries that would be able to integrate mechanical, electrical, or biological subcomponents.
“AMME is inspired by new insights from selective material synthesis and volumetric additive manufacturing that would enable a new class of microsystems,” said Michael Sangillo, AMME program manager. “We want to remove design rules imposed by traditional manufacturing tools and demonstrate novel microsystem technologies that create new opportunities for national security and emerging applications.”
Today’s methods are hamstrung by the inherent tradeoffs between resolution and throughput of traditional manufacturing: such as precise 3D printing that may be ultra-high resolution but subject to low throughput, or volumetric printing that’s high throughput but limited to lower resolution and one material at a time. AMME researchers will work to simultaneously synthesize high-quality multi-materials at unprecedented resolution levels and throughputs.
This will require AMME performers to invent radically new approaches for 3D additive manufacturing of complex geometric microsystems. This includes creating precursor material combinations that allow for rapid, multi-material printing that is not possible today. An additional challenge will be creating a fabrication process capable of printing at sub-micron resolution and extremely fast speeds. If successful, AMME will print a penny-sized microsystem (with 500 nm resolution) in about three minutes.
“Our objective is to demonstrate a novel, functional microsystem that achieves additive manufacturing advances not possible today – advances like the ability for astronauts to make on-demand repairs in space,” Sangillo said. “AMME will also focus on the commercialization approach, so we can produce a manufacturing system that can be quickly adopted by the broader industrial community, including DOD and other U.S. government organizations.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.