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Cadence Enables Next-Gen AI and HPC Systems with Industry’s Fastest HBM4 12.8Gbps IP Memory System Solution

04/21/2025 | Cadence Design Systems
Cadence announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory bandwidth needs of SoCs targeted for the next generation of AI training and HPC hardware systems.

Server DRAM and HBM Continue to Drive Growth, 4Q24 DRAM Industry Revenue Increases by 9.9% QoQ

02/28/2025 | TrendForce
TrendForce’s latest research reveals that global DRAM industry revenue surpassed US$28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.

Worldwide Semiconductor Revenue Grew 18% in 2024

02/03/2025 | Gartner, Inc.
Worldwide semiconductor revenue in 2024 totaled $626 billion, an increase of 18.1% from 2024, according to preliminary results by Gartner, Inc. Revenue is projected to total $705 billion in 2025.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

CHIPS Act Funds SK hynix's $3.87 Billion Investment in U.S. Semiconductor Supply Chain

12/19/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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