Enabling a New Paradigm for Flexible, Point of Need Design and Manufacturing
March 18, 2024 | DARPAEstimated reading time: 1 minute
The Department of Defense (DOD) needs the flexibility to manufacture critical structures at the time and point of need using locally available materials. Yet current manufacturing approaches for forward production operate under the assumption that pristine raw materials will be readily available; furthermore, any change in material input would require costly redesign. This means that structure designs are reliant on fixed inputs to produce fixed outputs, hindering the flexibility required for forward production where raw materials and resources are limited.
DARPA’s new Rubble to Rockets (R2) program aims to overcome current limitations to manufacturing in supply chain-denied environments by developing production and design approaches that can accommodate widely variable input materials. Performers will focus on creating an inexpensive, flexible, and robust platform for the production and characterization of raw material for use in structural fabrication. They will then seek to apply that platform to adaptively update a sounding rocket’s structural design.
“Existing manufacturing approaches require stability. Building a framework that can enable the manufacture of structures out of anything, anywhere, and at many sizes would break the status quo for manufacturing in resource-contested environments,” said Hunter Martin, DARPA’s program manager for the R2 program. “We’re focusing on sounding rockets for proof of concept because they represent a single-use structure with multiple components and complex structural requirements, but anticipate broad applicability to a wide range of manufacturing use cases – from spare parts and infrastructure repair to system production.”
R2 will also look to leverage material informatics and innovative processing and manufacturing techniques to dramatically drive down the timeframes and scale needed for production.
DARPA hypothesizes that the analytical framework R2 aims to develop would allow for rapid upgrades to incorporate the growing number of new material developments and fabrication methods, thus significantly reducing adoption risk that traditionally can take decades to retire. Additionally, advances in material conversion and learnings from the program may open entirely new spaces for highly available material with a lower-risk supply chain and energy footprint.
DARPA will share further details on R2 in a forthcoming Program Solicitation (PS). An R2 Industry Day is scheduled for Mar. 18, 2024, to provide information to potential proposers on the objectives of the program.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
08/20/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.