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IPC APEX EXPO 2024: A Preview of the Women in Electronics Reception
March 18, 2024 | Alicia Balonek, IPCEstimated reading time: 1 minute
Women comprise about 47% of the workforce and are statistically underrepresented in STEM fields, yet the number of women in STEM positions has steadily increased. In 1970, women comprised 8% of STEM roles. Today, they represent 27%. This jump is an encouraging sign for aspiring women in tech, but it shows there’s still a long way to go in ensuring the tech and STEM industries reflect the general workforce.
In the early years of this event, we introduced the Women in Electronics reception to allow the very few females at this event to meet and network with each other. Since the launch of IPC APEX EXPO in 2000, we’ve seen an increasing number of females attend the event each year.
Thankfully, through the years, we have had plenty of female trailblazers paving a path for the younger women entering this industry. Each year, we look forward to helping these women build their network so they can share their journey, learn from each other’s experiences, and support each other well beyond IPC APEX EXPO.
This year’s Women in Electronics Reception is scheduled from 6 to 7:30 p.m. Tuesday, April 9. It will feature a panel discussion led by IPC Hall of Famer Karen McConnell, Northrop Grumman, on work-life balance. Panelists include:
· Debie Vorwald, Collins Aerospace
· Despina Davis, Ph.D., Boeing Defense, Space & Security
· Paige Fiet, TTM Technologies
· Christina (Tina) Landon, Naval Surface Warfare Center, Crane Division (NSWC Crane)
They will discuss and highlight success stories and lessons learned on managing a successful career and family and how it’s possible for women to do it all.
Anyone attending IPC APEX EXPO is invited to this event, and we look forward to seeing you there.
Alicia Balonek is the senior director of trade shows and events at IPC.
This article originally appeared in the March 2024 issue of SMT007 Magazine.
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Rachael Temple - AlltematedSuggested Items
Building PCBs and Policy in Europe: Group ACB Champions Advocacy, Standards Development, and Technical Leadership
10/30/2025 | Linda Stepanich, Community MagazineHow does a European PCB manufacturer navigate the competitive manufacturing landscape in Europe? By participating in standards development committee meetings, testifying before the European Commission on industry issues, and sponsoring hand-soldering competitions in the region. Group ACB, based in France and Belgium, focuses on high-reliability applications. The 37-year-old company is also active in the Global Electronics Association, giving credit for helping ACB to raise awareness of electronics manufacturing in Europe.
Light-curable Solutions for Reliable Electronics in Space Applications
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SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.