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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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SMTA Europe Announces 2024 Spring Conferences
March 22, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA announces three conferences taking place in Europe this spring..
The Advanced Electronics Assembly Conference (AEAC) will co-locate with InnoElectro, 24 April 2024 in Budapest, Hungary. This strategic venue selection promises greater exposure, a larger audience, and the opportunity to attract high-quality attendees. Visit the conference website here: https://smta.org/aeac
County Clare, Ireland, is the location of the Advanced Manufacturing Conference and Line Tour on 9 May 2024. The conference will feature three distinct sessions covering Product Management, Advanced Manufacturing, and Sustainability. A tour of the Ei Electronics manufacturing facility is planned for the afternoon.
The following week the Electronics in Harsh Environments Conference takes place 14-16 May 2024 at the Technical University of Denmark in Copenhagen. This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments and power electronics. Keynote presentations and professional development courses are featured each day of the event and included in conference registration. Details can be found on the conference website.
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