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Contract Price Increases Offset Seasonal Slump, Boosting DRAM Q1 Revenue by 5.1%

06/13/2024 | TrendForce
TrendForce reveals that the DRAM industry experienced a 5.1% revenue increase in 1Q24 compared to the previous quarter. This growth—reaching US$18.35 billion—was driven by rising contract prices for mainstream products, with the price increase being more significant than in 4Q23. As a result, most companies in the industry continued to see revenue growth.

Samsung Reportedly Achieves Technical Breakthrough, Stacking 3D DRAM to 16 Layers

06/05/2024 | PRNewswire
According to the news report from DIGITIMES Asia, Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024

05/20/2024 | TrendForce
TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year.

DRAM Contract Prices for Q2 Adjusted to a 13–18% Increase

05/07/2024 | TrendForce
TrendForce’s latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13–18%, while NAND Flash contract prices have been adjusted to a 15–20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.

HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total DRAM Value

05/06/2024 | TrendForce
Avril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI chips.
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