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Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
March 27, 2024 | MycronicEstimated reading time: 4 minutes
Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
Mycronic will exhibit its next-generation MYPro A40 pick-and-place solution, equipped with an all-new MX7 high-speed mounthead technology. The new platform increases top placement speeds by 48% while handling a significantly wider range of component types and sizes.
Manufacturers aiming to boost throughput will welcome the MYPro A40DX’s IPC-rated top speed of 59,000 cph (components per hour). The new MX7 mounthead achieves this by integrating seven independent placement nozzles steered by individual Z and theta motors. To accommodate a wider range of applications and technologies, the new mounthead expands the upper component size limit by six times, enabling placement of components as large as 45×45×15 mm or 150×40×15 mm. A high precision mounthead complements the MX7 to mount chip components as small as 0.3×0.15 mm (009005), and components as large as 99×73×15/22 mm.
Outside the machine, a newly designed graphical user interface has been introduced to simplify both training and pick-and-place operations for even novice operators. By providing straightforward touchscreen guidance, the MYPro A40 moves the pick-and-place process another step forward towards the company’s ambition of fully automated one-click operations.
The latest breakthroughs in advanced AOI
The MYPro I series 3D AOI, the company’s latest flagship in-line inspection system, will display its Iris 3D AOI vision technology, which enables manufacturers to improve test coverage while capturing the industry’s highest-resolution images at speeds up to thirty percent faster than previous technologies.
Escape Tracker, a real-time programming assistant embedded in the MYWizard programming software, will demonstrate entirely new levels of reliability and speed in 3D AOI programming. A live demo will show how the software continuously analyzes and updates the system's inspection library to eliminate escapes, dramatically reduce false calls, and constantly improve inspection models over time.
AI in action
A long list of advances in automatic component detection and recognition, automatic component position detection and more accurate 3D review images have been made by Mycronic in recent years. A pioneer in the use of machine learning in SPI and AOI, the company welcomes IPC APEX visitors to discuss the latest advances in neural networks and their applications for AI-assisted improvements in electronics inspection.
Zero-defect and productive printing
New for Mycronic customers, the MYPro S series is a robust, highly accurate and user-friendly range of stencil printers. True to the MYPro production philosophy, it enables the fastest possible changeovers and features all the functionalities expected from a modern screen printer. IPC APEX visitors will experience the advantages of stencil printing, combined with the MY700 Jet Printer and PI series 3D SPI, which together enable add-on printing and closed-loop solder-paste repair functionality. For high-reliability electronics manufacturers looking for the fastest cycle times, this add-on configuration combines the flexibility and accuracy of jet printing with the throughput of stencil printing in a single, integrated and cost-efficient platform. And thanks to the precise information provided by cutting-edge SPI 3D inspection, the Jet Printer seamlessly fills any paste gaps for zero-defect printing.
Enhanced connectivity and process control
New process control solutions to be introduced at IPC APEX include an updated MYCenter Analysis pick-and-place dashboard, now featuring a component analytics function that enables faster drill-down into specific process settings for each component. This allows users to better understand and resolve the root causes of process detractors to dramatically improve first-pass yield. Regarding connectivity, the MYPro Connect software enables vertical communication with MES and ERP systems at line level, using the IPC CFX standard. It completes the horizontal connectivity brought by the Hermes protocol, allowing machine-to-machine communication down the production line.
Tailored solutions for automated electronics protection
Finally, to meet growing demand for high-precision electronics protection, Mycronic will present its suite of MYSmart coating and dispensing solutions. At IPC APEX, visitors will be able to experience versatile conformal coating and dispensing solutions and the latest valve technologies, many of which are now firmly established as the leading choices among global tier-one manufacturers.
Producers of consumer electronics, in particular, will welcome the high-speed jet dispensing valve technologies available for the MY700 Jet Printer and Jet Dispenser, making it the industry’s fastest all-material jetting system. Wherever large-area, random-dot dispensing patterns are crucial to manufacturing quality and efficiency, the new jetting system brings the speed and accuracy of the MY700 into a far wider range of dispensing fluid applications.
“Wherever we can add new levels of flexibility, accuracy, advanced automation and easy usability, Mycronic continues to deliver value to its customers,” says Clemens Jargon, Sr VP High Flex Division. “At IPC APEX EXPO, we are thrilled to continue to lead the way by providing the most advanced turnkey solutions for every stage of PCB assembly.”
To experience live demos and to learn more about Mycronic’s MYPro Line, software and connectivity solutions, and MYSmart dispensing and coating platforms, visit booth #742 at IPC APEX EXPO in Anaheim, CA on April 9 - 11.
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