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Thailand Electronics Circuit Asia 2024 Kicks Off

07/24/2024 | Nolan Johnson, I-Connect007
After a long and grueling experience through last week’s airline IT meltdowns, I finally touched down in Bangkok, where I’m here for the inaugural Thailand Electronics Circuit Asia (THECA) show. The expo and technical conference kicked off Wednesday at the Bangkok International Trade and Exhibition Center, featuring an expo and a technical conference.

TRI Brings High-Speed Line Inspection at the SMTA Guadalajara 2024

07/24/2024 | TRI
Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2024 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #1018 at the SMTA Expo Guadalajara from September 11 to 12, 2024, to experience the latest test and inspection innovations for the Electronics Manufacturing Industry.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 3

07/24/2024 | I-Connect007 Editorial Team
This chapter provides an in-depth analysis of general-purpose and specialist encapsulation resins for electronic applications. Also covered are properties, testing methods, suitability for harsh environments, and thermal management of high-power density electronic devices.

JPCA Show Review: Sizing Up the Market in Japan

07/09/2024 | James Stone, IEC
As a relatively newer member of the PCB industry,  I found the Japan Printed Circuit Association (JPCA) show, held in June at the Tokyo Big Sight Convention Hall, to be a great experience. This year’s show was considered smaller compared to past years, but I was still impressed by the size and number of attendees.

Semidynamics Releases Tensor Unit Efficiency data for its new All-In-One AI IP

06/25/2024 | Semidynamics
Semidynamics, the European RISC-V custom core AI specialist, has announced Tensor Unit efficiency data for its ‘All-In-One’ AI IP running a LlaMA-2 7B-parameter Large Language Model (LLM).
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