Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

OLED Notebook Shipments Forecast to Grow 40% in 2027 Amid New MacBook Pro Launch

10/29/2026 | TrendForce
Apple’s newly unveiled MacBook Pro with PROLED XDR Display marks a significant milestone in the evolution of MacBook display technology and user experience, becoming the first model in the lineup to feature a tandem OLED touchscreen.

Seoul Semiconductor Ends Need for Rare Earths in White LEDs Share

10/28/2026 | BUSINESS WIRE
For three decades, white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip.

Teledyne FLIR Wins $48M Contract for Bulgaria’s Stryker NBC Sensors

10/26/2026 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced it has been awarded a $48 million contract by the U.S. Army to deliver Nuclear, Biological and Chemical Reconnaissance Vehicle (NBCRV) Sensor Suite Upgrades (SSU) to the Republic of Bulgaria for its new fleet of Stryker vehicles.

Rehm Thermal Systems Receives 2026 Mexico Technology Award for RDS UV LED

10/22/2026 | Rehm Thermal Systems
Rehm Thermal Systems has been honored with a 2026 Mexico Technology Award for its innovative RDS UV LED curing system. The award was presented on October 7 in conjunction with SMTA Guadalajara.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in