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Revolutionizing Precision Soldering: Introducing the iBot-i1/2s by Sasinno Americas
April 2, 2024 | Sasinno AmericasEstimated reading time: 1 minute
Sasinno Americas is pleased to introduce its latest advancement in soldering technology – the iBot-i1/2s. This cutting-edge system redefines precision soldering with groundbreaking features designed to elevate efficiency and performance in electronics manufacturing processes. The system will be on display for the first time during the 2024 IPC APEX EXPO.
Key Competitive Edges:
PC Control for Enhanced Precision: The iBot-i1/2s sets a new standard with its PC-based control system, offering superior accuracy and an intuitive user interface compared to traditional teaching pad-based controls.
Advanced Camera Integration: Setting itself apart from competitors, the iBot series integrates advanced cameras for both programming and fiducial checking, ensuring accuracy and efficiency.
Superior Drive Mechanism: Utilizing servo motors and ball screws, the iBot-i1/2s delivers unmatched precision and reliability, eliminating the need for regular tension adjustments common with timing belt-driven stepper motors.
High-Performance JBC Solder Stations: Featuring original JBC solder stations, the iBot-i1/2s offers exceptional heat recovery and durability, guaranteeing seamless soldering experiences.
A Leader in Dual-Tip Soldering
The iBot-i1/2s addresses a common challenge in electronics manufacturing by offering dual-tip soldering capabilities on a single table. With distinct solder irons featuring different tip models, this innovative solution streamlines the soldering process without compromising precision, eliminating the need for multiple machines and reducing costs.
As the demand for versatility in soldering processes continues to grow, the iBot-i1/2s is tailored to the complexity of modern PCB designs. With joints varying in size and thermal requirements, this advanced system adapts seamlessly to diverse manufacturing needs.
Visit Booth 4027 at IPC APEX EXPO 2024 to experience firsthand the future of soldering technology.
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.