-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Infineon, HD Korea Shipbuilding & Offshore Engineering Jointly Develop Ship Electrification Technology
April 3, 2024 | InfineonEstimated reading time: 1 minute
Infineon Technologies AG and HD Korea Shipbuilding & Offshore Engineering Co. Ltd. have signed a non-binding Memorandum of Understanding (MoU) as a first step towards jointly developing emerging applications for the electrification of marine engines and machinery using energy-efficient power semiconductor technology.
HD KSOE, a marine pioneer and global leader in ship building, is already focusing on creating eco-friendly decarbonized ship technology that uses electricity and hydrogen. The company will now cooperate with Infineon to create innovative power solutions for propulsion drive technology, a core element for ship electrification. Power semiconductors from Infineon drive the transformation towards clean, safe, and smart mobility services across all means of transportation. For modern maritime applications they are a key factor in guaranteeing a precise control of multiple power modules, such as large-capacity propulsion drives.
Infineon will provide HD KSOE with technical assistance and mentoring in semiconductor power modules and system solutions, as well as share information on new semiconductor trends for marine applications. With the partnership HD KSOE aims to enhance reliability and performance of marine vessels’ propulsion drive technology contributing to environmental sustainability through the electrification of ships.
Worldwide, maritime transport is responsible for almost 2.5 percent of total greenhouse gas emissions, according to the International Maritime Organization. It produces one billion tons of CO 2 each year. The transition to electric ships is imperative to mitigate the environmental impact of maritime transportation.
"We are pleased to sign an MoU with Infineon, which underpins our innovation efforts to become a leader in ship electrification technology," said Chang Kwang-pil, Chief Technology Officer of HD KSOE. "Together, we will combine our strengths to create energy-efficient power solutions for CO2-friendly propulsion drives."
"At Infineon we are providing the technologies needed in today's world of transportation to drive electrification that will shape the future of mobility," said Dr. Peter Wawer, Division President Green Industrial Power at Infineon Technologies. "We are excited to work closely together with HD KSOE to develop clean, safe and smart mobility solutions. This way, we contribute to a more sustainable marine engine ecosystem and drive the decarbonization of shipping."
Suggested Items
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?
Nordic Semiconductor Accelerates Edge AI Leadership with Acquisition of Neuton.AI
06/18/2025 | PRNewswireNordic Semiconductor, the global leader in ultra-low-power wireless connectivity solutions, today announced its acquisition of the intellectual property and core technology assets of Neuton.AI, a pioneer in fully automated TinyML solutions for edge devices.
Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
06/17/2025 | Keysight TechnologiesKeysight Technologies, Inc. in collaboration with NTT Corporation and NTT Innovative Devices Corporation (NTT Innovative Devices), today announced a groundbreaking world record in data rate achieved using sub-THz frequencies.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,