-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Infineon, HD Korea Shipbuilding & Offshore Engineering Jointly Develop Ship Electrification Technology
April 3, 2024 | InfineonEstimated reading time: 1 minute
Infineon Technologies AG and HD Korea Shipbuilding & Offshore Engineering Co. Ltd. have signed a non-binding Memorandum of Understanding (MoU) as a first step towards jointly developing emerging applications for the electrification of marine engines and machinery using energy-efficient power semiconductor technology.
HD KSOE, a marine pioneer and global leader in ship building, is already focusing on creating eco-friendly decarbonized ship technology that uses electricity and hydrogen. The company will now cooperate with Infineon to create innovative power solutions for propulsion drive technology, a core element for ship electrification. Power semiconductors from Infineon drive the transformation towards clean, safe, and smart mobility services across all means of transportation. For modern maritime applications they are a key factor in guaranteeing a precise control of multiple power modules, such as large-capacity propulsion drives.
Infineon will provide HD KSOE with technical assistance and mentoring in semiconductor power modules and system solutions, as well as share information on new semiconductor trends for marine applications. With the partnership HD KSOE aims to enhance reliability and performance of marine vessels’ propulsion drive technology contributing to environmental sustainability through the electrification of ships.
Worldwide, maritime transport is responsible for almost 2.5 percent of total greenhouse gas emissions, according to the International Maritime Organization. It produces one billion tons of CO 2 each year. The transition to electric ships is imperative to mitigate the environmental impact of maritime transportation.
"We are pleased to sign an MoU with Infineon, which underpins our innovation efforts to become a leader in ship electrification technology," said Chang Kwang-pil, Chief Technology Officer of HD KSOE. "Together, we will combine our strengths to create energy-efficient power solutions for CO2-friendly propulsion drives."
"At Infineon we are providing the technologies needed in today's world of transportation to drive electrification that will shape the future of mobility," said Dr. Peter Wawer, Division President Green Industrial Power at Infineon Technologies. "We are excited to work closely together with HD KSOE to develop clean, safe and smart mobility solutions. This way, we contribute to a more sustainable marine engine ecosystem and drive the decarbonization of shipping."
Suggested Items
Würth Elektronik Offers its Radio Module for LoRaWAN Communication
11/19/2024 | Wurth ElektronikWürth Elektronik launches Daphnis-I on the market – a slim, ultra-low power consumption and long range radio module for IoT applications.
RTX's Raytheon Awarded U.S. Army Contract for Wireless Power Beaming Technology
11/18/2024 | Raytheon TechnologiesRaytheon, an RTX, has been awarded a contract from the U.S. Army to work on directed energy wireless power beaming capabilities that will distribute power across the battlefield, simplify logistics, and safeguard locations for U.S. troops.
Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES
11/14/2024 | BoeingBoeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.
Renesas Jointly Developed World-Class '8-in-1' Proof of Concept with Nidec
11/12/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions using a single microcontroller (MCU).
Aismalibar to Showcase Advanced Thermal Management Solutions for Electronics at electronica 2024
11/11/2024 | AismalibarAismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.