Electronic System Design Industry Posts $4.4 Billion in Revenue in Q4 2023, ESD Alliance Reports
April 9, 2024 | SEMIEstimated reading time: 1 minute

Electronic System Design (ESD) industry revenue increased 14% to $4,423 million in the fourth quarter of 2023 from the $3,879.9 million logged in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.1%.
“Electronic design automation (EDA) continued to report strong revenue growth in Q4 2023,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “The Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services categories reported double-digit growth. Further, all geographic regions reported substantial growth.”
The companies tracked in the EDMD report employed 60,106 people globally in Q4 2023, an 8.9% jump over the Q4 2022 headcount of 55,192 and up 0.6% compared to Q3 2023.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 19.5% to $1,512.1 million. The four-quarter CAE moving average increased 19.3%.
- IC Physical Design and Verification revenue declined 1% to $691.5 million. The four-quarter moving average for the category increased 20%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 21% to $410.8 million. The four-quarter moving average for PCB and MCM rose 18.9%.
- Semiconductor Intellectual Property (SIP) revenue increased 13.7% to $1,632.4 million. The four-quarter SIP moving average rose 5.9%.
- Services revenue jumped 25.4% to $176.2 million. The four-quarter Services moving average rose 10.8%.
Revenue by Region – Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $1,921 million of electronic system design products and services in Q4 2023, an 11.9% increase. The four-quarter moving average for the Americas rose 11.6%.
- Europe, Middle East, and Africa (EMEA) procured $608.2 million of electronic system design products and services in Q4 2023, a 20.5% increase. The four-quarter moving average for EMEA grew 17.8%.
- Japan’s procurement of electronic system design products and services grew 8.3% to $262 million. The four-quarter moving average for Japan increased 9.4%.
- Asia Pacific (APAC) procured $1,631.8 million of electronic system design products and services in Q4 2023, a 15.2% increase. The four-quarter moving average for APAC grew 16.7%.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.