MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling
April 9, 2024 | ESIEstimated reading time: 2 minutes
MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials.
To address the increased market pressure manufacturers face to deliver components that meet precise via and material requirements for today's advanced electronics, the next generation Geode™ G2 laser drilling system offers advancements in beam control capabilities, optical transmission, thermal management, and AOD technology. These innovations enable PCB manufacturers to meet the high accuracy and throughput demands of today's complex PCB applications that utilize high-frequency compatible materials and finer-pitched interconnects. The lightweight frame design of the Geode G2 provides extensive flexibility for factory floor layouts due to its smaller footprint and, combined with industry-leading application flexibility, enables customers to design the factory of the future.
"Our partners are working to resolve some of the most complex challenges in PCB via drilling, including producing new components in emerging technology markets such as low earth orbit satellites. They also face the challenge of building new factories within the rapidly expanding Southeast Asia market," said Michael Stubelt, MKS Vice President and General Manager - Equipment Solutions Business "We are committed to providing our customers with the most innovative CO2 laser drilling system on the market to help meet these challenges. We are proud to announce that the Geode G2 laser drill beta systems have proven successful in key applications, and we have recently received our first multi-unit order for high-volume manufacturing. This new system will allow our partners to push the boundaries of possibility in PCB manufacturing."
Geode™ G2 laser drilling system utilizes HyperSonix™ technology that shapes laser pulses with sound waves for better throughput and quality. In addition, AcceleDrill™ distributes pulse energy for maximum throughput and allows multiple via sizes in one pass. An industry first for CO2 via drilling, the Beam Characterization Tool (BCT) monitors beam quality and spot health while its automated run-time calibration lowers the cost of ownership.
The Geode™ G2 laser drilling system is available for purchase. More details can be found at www.esi.com, and system experts will be available at the IPC APEX Event, Anaheim, California, April 9-11 in booth 4412.
MKS Instruments enables technologies that transform our world. We deliver foundational technology solutions to leading edge semiconductor manufacturing, electronics and packaging, and specialty industrial applications. We apply our broad science and engineering capabilities to create instruments, subsystems, systems, process control solutions and specialty chemicals technology that improve process performance, optimize productivity and enable unique innovations for many of the world’s leading technology and industrial companies. Our solutions are critical to addressing the challenges of miniaturization and complexity in advanced device manufacturing by enabling increased power, speed, feature enhancement, and optimized connectivity. Our solutions are also critical to addressing ever-increasing performance requirements across a wide array of specialty industrial applications. Additional information can be found at www.mks.com.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.
CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics
03/11/2026 | NcodiNCEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.