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HBM3e Production Surge Expected to Make Up 35% of Advanced Process Wafer Input by End of 2024

05/20/2024 | TrendForce
TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year.

DRAM Contract Prices for Q2 Adjusted to a 13–18% Increase

05/07/2024 | TrendForce
TrendForce’s latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13–18%, while NAND Flash contract prices have been adjusted to a 15–20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.

HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total DRAM Value

05/06/2024 | TrendForce
Avril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI chips.

Minimal Initial Damage to DRAM and Foundry Production Lines Following Major Earthquake in Taiwan on April 3

04/03/2024 | TrendForce
In the wake of a 7.2-magnitude earthquake off the eastern coast of Taiwan at 7:58 AM on April 3rd, TrendForce immediately investigated the damage and operational status of various manufacturers.

Suppliers Aim to Raise Contract Prices, But With Uncertain Demand, 2Q24 DRAM Price Increase Expected to Narrow to 3–8%

03/26/2024 | TrendForce
TrendForce’s latest report reveals that despite DRAM suppliers’ efforts to trim inventories, they have yet to reach healthy ranges. As they continue to improve their lose situations by boosting capacity utilization rates, the overall demand outlook for this year remains tepid.
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