Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Growing Wire Harness Industry in India Highlighted at EWPTE 2024

05/24/2024 | Brittany Martin, IPC/WHMA Marketing Coordinator
“Made in India” was a central phrase at EWPTE 2024. The wire harness event hosted the inaugural “India Pavilion” which showcased Indian wire harness companies on the exhibit floor.

IDTechEx Asks if Silicon Anodes Are the Key to Mass EV Adoption

05/24/2024 | PRNewswire
Maximizing energy density has been one key area of focus in electric vehicle battery development. Optimizations in cell and battery pack designs, alongside the use of higher nickel NMC and NCA cathodes, have led to steady improvement in battery energy density over the past 10-15 years.

The Knowledge Base: The Transformative Role of AI and ML

05/22/2024 | Mike Konrad -- Column: The Knowledge Base
Artificial intelligence (AI) and machine learning (ML) are at the vanguard of a technological revolution, redefining the parameters of manufacturing and business processes. Perhaps their most notable impact is within the electronics assembly industry, where they drive unprecedented levels of automation, enhancing efficiency and contributing to significant financial outcomes. This exploration delves into the transformative role of AI and ML, shedding light on the mechanisms of automation enhancement and the resultant financial implications.

Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC

05/21/2024 | Real Time with...IPC APEX EXPO
Devan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.

SEMICON Europa 2024 Call for Abstracts Opens

05/21/2024 | SEMI
SEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in