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Thin Film Interconnect (TFI), Heisler Semiconductor LLC Announce Strategic Technology Partnership

06/04/2025 | PRNewswire
Thin Film Interconnect (TFI), based in Frederick, Maryland, is pleased to announce a strategic technology partnership with Heisler Semiconductor LLC, headquartered in Baltimore, Maryland.

DuPont Powers AI, Next-Gen Electronics with Advanced Interconnect Innovations at JPCA Show 2025

06/04/2025 | PRNewswire
DuPont announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at the Tokyo Big Sight East Exhibition Halls. At Booth #6C-03,

Imec Demonstrates 16nm Pitch Ru Lines with Record-low Resistance Obtained Using a Semi-damascene Integration Approach

06/03/2025 | Imec
At the 2025 IEEE International Interconnect Technology Conference (IITC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents Ru lines at 16nm pitch with average resistance as low as 656Ω/µm.

UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes

06/03/2025 | Anaya Vardya, American Standard Circuits
The combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.

Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025

05/30/2025 | Foxconn
The research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
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