Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure

06/19/2024 | BUSINESS WIRE
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s 7nm process.

Indium Corporation Expert to Present at High-Temperature Electronics Network Conference

06/18/2024 | Indium Corporation
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.

Summit Interconnect Appoints David Lane as New General Manager and VP of Denver-based Advanced Assembly

06/13/2024 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all aspects of operations within Summit’s Denver-based facility, Advanced Assembly.

Collaboration and Data Management the Focus of Latest Podcast From Cadence and I-Connect007

06/19/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology—Data Management,” product engineering expert Mark Hepburn joins the podcast to discuss the value of collaboration in the printed circuit board design and manufacturing cycle. Hepburn shares his views on how the latest data infrastructures are changing and enabling greater—and safer—data sharing.

Global Spending on Telecom and Network APIs Forecast to Reach $6.7 Billion in 2028

06/06/2024 | IDC
Worldwide revenues for telecom and network APIs will reach $6.7 billion in 2028, according to a new forecast from International Data Corporation (IDC).
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in