Renesas Expands Quick Connect Studio
April 11, 2024 | BUSINESS WIREEstimated reading time: 2 minutes
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced new features and additional coverage for its Quick Connect Studio, a cloud-based embedded system design platform. Quick Connect Studio enables users to graphically co-optimize hardware and software to quickly validate prototypes and accelerate product development.
Quick Connect Studio empowers engineers to graphically drag and drop device and design blocks on the Cloud to build their solution. After placing each block, users can generate, compile, and build the base software automatically, a major shift towards the no-code paradigm of development. This makes building production-level software as easy as piecing building blocks together. There is very little upfront learning or investment needed. The cloud compute power provides fast compilation, and the intuitive GUI reduces the learning curve. Quick Connect Studio automatically generates system software that can be iteratively tested on the hardware.
Renesas is continuing to expand this platform with a broad portfolio of growing number of devices from Renesas and partners that users can use to build their prototype systems. Quick Connect Studio now offers support for all the Renesas RA MCU boards, as well as multiple Renesas wireless modules and sensors. Additionally, devices from partners such as ams OSRAM, TDK, and Arducam have been added to further broaden the range of supported applications and designs. Quick Connect Studio can now help users build over 350 systems using Renesas MCU and breakout boards. Renesas is working with more suppliers and partners to automate the addition of their complementary devices, thus providing customers a broad portfolio of supported devices to build their system designs.
Renesas is now introducing real-time code customization and remote debugging for Quick Connect Studio users. The automatically generated code can be customized real-time in the browser application. Using remote board farms, the code can be tested on target hardware dynamically to verify the operation before buying or building the physical board and setting up the test system. This capability dramatically speeds up the process of building proof of concepts and prototyping system solutions by concurrently working on both software and hardware components of system design.
Renesas now offers multi-region secure infrastructure deployments around the world for uniform user experience, fastest response and reduced latency. This enables auto-scaling to accommodate multiple concurrent users to access the platform anywhere, anytime.
“Quick Connect Studio is a transformational offering for the industry,” said DK Singh, Vice President, Digitalization for Renesas. “For the first time, engineers can now pursue hardware and software development simultaneously. Our aim is to remove all the preparatory work from the system development process. This is a radical shift, enabling designers to focus their resources and energy on their core innovation, build software immediately with the ability to quickly reconfigure and test product ideas.”
“Renesas is empowering customers to accelerate their proof of concepts and production processes through Quick Connect Studio,” said Sahil Choudhary, Director of Marketing at TDK. “Once integrated into this platform, customers can seamlessly incorporate our MEMS 6-axis motion sensor with any Renesas RA MCU, generating production-ready code within minutes, without delving into intricate technical details.”
Renesas’ Quick Connect Studio is a part of Renesas Quick Connect, a platform of standardized hardware featuring industry-established interfaces such as PMOD™, Arduino, and MIKROE. With standard connectors, engineers can mix and match MCUs, MPUs, sensors, and connectivity boards seamlessly. In the future, users will be able to extend and expand beyond Renesas to different partners such as major cloud providers, service integrators, and leaders in the open-source community.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
European Space Agency, Raymetrics Select Xairos as Subcontractor for ESA Project
11/14/2025 | BUSINESS WIREXairos UK, Ltd., a UK-based quantum technology company, announces its selection by Raymetrics S.A. (Raymetrics) and the European Space Agency (ESA) for the delivery of a Quantum Receiver for the Observatories to Optical Ground Stations (Obs2OGS) project.
GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
11/05/2025 | GlobalFoundriesGlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, and Silicon Labs, the leading innovator in low-power wireless, announced the expansion of their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale U.S.-based semiconductor manufacturing.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
On the Line with… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line with… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.