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iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES

11/14/2024 | Boeing
Boeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.

Bloom Energy, Quanta Computer Expand Partnership to Power AI Revolution

11/11/2024 | BUSINESS WIRE
Bloom Energy, a world leader in solid oxide fuel cell (SOFC) technology, and Quanta Computer Inc., a premier Taiwanese electronics manufacturer, announced a major expansion of an existing agreement to power the production of critical hardware serving the AI industry. The new agreement increases the power capacity of Quanta’s existing Bloom SOFC installation by more than 150 percent and will circumvent a costly utility interconnection delay to keep up with rapidly growing demand for orders.

Tresky's Laser- and Photodiodes DIE Bonding in Optoelectronics

11/05/2024 | Tresky GmbH
In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role for the performance and lifespan of laser diodes (LD) and photodiodes (PD).

PCB Designers: Enhance Your Listening Experience With New Companion Download to the DFR Podcast Series

11/11/2024 | I-Connect007
Exciting news for listeners of On the Line With... Designing for Reality, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from ASC Sunstone’s expert Matt Stevenson is now available for download.
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