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Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers

05/23/2024 | I-Connect007
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.

Peter Sarmanian Corporate Recognition Award: Summit Interconnect

05/23/2024 | I-Connect007 Editorial Team
Congratulations to Summit Interconnect for receiving the 2024 Peter Sarmanian Corporate Recognition Award. This award was named for a former IPC Board Chairman and recognizes an IPC-member company in the printed board industry (PCB) that has supported IPC through participation in technical and management programs while providing leadership for the industry.

SatixFy, SCOTTY Group Partner to Supply In-Flight Connectivity Terminals

05/23/2024 | BUSINESS WIRE
SatixFy Communications Ltd., a leader in next-generation satellite communication systems based on in-house-developed chipsets, announced a collaboration and the first order of its in-flight connectivity (IFC) terminals, Onyx, with SCOTTY Group Austria GmbH (“SCOTTY”), a leading manufacturer and integrator of communication solutions, including in-flight connectivity for aircraft.

Amphenol Completes Acquisition of CIT Business from Carlisle

05/22/2024 | BUSINESS WIRE
Amphenol Corporation announced it had completed the acquisition of the Carlisle Interconnect Technologies (CIT) business from Carlisle Companies Incorporated.

Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC

05/21/2024 | Real Time with...IPC APEX EXPO
Devan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
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