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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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What’s New in Design Education at IPC APEX EXPO?
April 11, 2024 | Kelly Allen, IPC Training ManagerEstimated reading time: Less than a minute
Kelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.
Kel, why should PCB designers and design engineers attend the conference at IPC APEX EXPO?
Kelly Allen: Adult learners appreciate practical knowledge. In our online classes, PCB designers and design engineers connect theoretical concepts to real-world situations, making our online classroom discussions dynamic and relevant. Many are driven by personal and professional goals so attending an APEX EXPO Professional Development Course allows them to actively participate, ask the speaker thought-provoking questions, and engage in meaningful dialogue. Our industry keeps our designers so busy that many do not have time to take one of our long-form courses. Yet they can invest a few days to take PD courses, attend committee meetings, network with colleagues, and see the latest in manufacturing and products on the show floor.
To read this entire conversation, which appeared in the April 2024 issue of Design007 Magazine, click here.
Suggested Items
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.