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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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What’s New in Design Education at IPC APEX EXPO?
April 11, 2024 | Kelly Allen, IPC Training ManagerEstimated reading time: Less than a minute
Kelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.
Kel, why should PCB designers and design engineers attend the conference at IPC APEX EXPO?
Kelly Allen: Adult learners appreciate practical knowledge. In our online classes, PCB designers and design engineers connect theoretical concepts to real-world situations, making our online classroom discussions dynamic and relevant. Many are driven by personal and professional goals so attending an APEX EXPO Professional Development Course allows them to actively participate, ask the speaker thought-provoking questions, and engage in meaningful dialogue. Our industry keeps our designers so busy that many do not have time to take one of our long-form courses. Yet they can invest a few days to take PD courses, attend committee meetings, network with colleagues, and see the latest in manufacturing and products on the show floor.
To read this entire conversation, which appeared in the April 2024 issue of Design007 Magazine, click here.
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
Rules of Thumb: A Primer
11/14/2024 | Andy Shaughnessy, Design007 MagazineMany industry-wide rules of thumb are based on DFM constraints or formulas, but others are based on tribal knowledge. In this interview, Andy Shaughnessy sits down with our contributors Kris Moyer and Kelly Dack to discuss the role of rules of thumb, when to employ them, and when it’s time to do the math.
Elementary, Mr. Watson A Designer's Dilemma—Metric or Imperial Units?
11/07/2024 | John Watson -- Column: Elementary, Mr. WatsonIn the early 1800s, as trains began to spread across the United States, different companies built their tracks in ways that made sense to them. They chose their track widths (gauges) with no set standard. Some tracks were about four feet wide, with others at five or even six feet. Each company thought their choice was best, but this led to a big problem: Trains from one track couldn't run on another if the gauges didn't match. Often, trains had to stop at the state line for all their goods and passengers to switch trains, which cost extra time and money.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.