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On a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry. The local government leader, the group leader of Shenzhen capital，and Liu Yang，the founder and general manager of Newccess Industrial, attended the ceremony and jointly laid the foundation for the project.
The project, located in the Guangming District, boasts a total construction area of 37,500 square meters，expected to have a total investment of 860 million yuan. It will mainly be used for the research and development and manufacturing of Newccess Build-up Film（NBF） series electronic materials. This product is one of the key core materials in advanced semiconductor processes and is widely used in high-performance chip packaging such as CPUs, GPUs, and AI intelligence.Once completed, it will become the largest production base for Semiconductor Package ICs Build-up Film in the domestic market.
The construction of the MINGXIN Building and Semiconductor Materials project is expected to further strengthen the company's position， in the semiconductor material industry，also for the expansion needs of PCB drilling Entry&Backup board. The new building will not only provide a modern and efficient workspace for research and development, production, and other activities, but also help to attract top talent and promote technological innovation.
The groundbreaking ceremony was attended by representatives from the local government of Shenzhen, as well as officials and executives from Shenzhen capital. They expressed their confidence in the project and looked forward to its completion, which they believe will bring significant benefits to the local economy and the semiconductor industry at large.
In conclusion, the groundbreaking ceremony for the MINGXIN Building and Semiconductor Package ICs Newccess Build-up Film project，marks a new era for the semiconductor new material industry. With its commitment to innovation and excellence, Newccess Build-up Film project is poised to lead the way in the development of Package ICs material and other advanced semiconductor materials, driving forward the progress of the global semiconductor industry.
