Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building
April 12, 2024 | Newccess IndustrialEstimated reading time: 1 minute

On a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry. The local government leader, the group leader of Shenzhen capital,and Liu Yang,the founder and general manager of Newccess Industrial, attended the ceremony and jointly laid the foundation for the project.
The project, located in the Guangming District, boasts a total construction area of 37,500 square meters,expected to have a total investment of 860 million yuan. It will mainly be used for the research and development and manufacturing of Newccess Build-up Film(NBF) series electronic materials. This product is one of the key core materials in advanced semiconductor processes and is widely used in high-performance chip packaging such as CPUs, GPUs, and AI intelligence.Once completed, it will become the largest production base for Semiconductor Package ICs Build-up Film in the domestic market.
The construction of the MINGXIN Building and Semiconductor Materials project is expected to further strengthen the company's position, in the semiconductor material industry,also for the expansion needs of PCB drilling Entry&Backup board. The new building will not only provide a modern and efficient workspace for research and development, production, and other activities, but also help to attract top talent and promote technological innovation.
The groundbreaking ceremony was attended by representatives from the local government of Shenzhen, as well as officials and executives from Shenzhen capital. They expressed their confidence in the project and looked forward to its completion, which they believe will bring significant benefits to the local economy and the semiconductor industry at large.
In conclusion, the groundbreaking ceremony for the MINGXIN Building and Semiconductor Package ICs Newccess Build-up Film project,marks a new era for the semiconductor new material industry. With its commitment to innovation and excellence, Newccess Build-up Film project is poised to lead the way in the development of Package ICs material and other advanced semiconductor materials, driving forward the progress of the global semiconductor industry.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
SkyWater Completes Acquisition of Fab 25, Expanding U.S. Pure-Play Foundry Capacity for Critical Semiconductor Technologies
09/12/2025 | SkyWaterSkyWater Technology, the trusted technology realization partner, announced that it has completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”)
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.