DOCOMO, NTT, NEC and Fujitsu Develop Top-level Sub-terahertz 6G Device
April 12, 2024 | JCN NewswireEstimated reading time: 2 minutes
NTT DOCOMO, INC., NTT Corporation, NEC Corporation and Fujitsu Limited jointly announced today the development of a top-level (1) wireless device capable of ultra-high-speed 100 Gbps transmissions in the 100 GHz and 300 GHz sub-terahertz bands.
The four companies have been jointly conducting R&D on sub-terahertz devices since 2021 in anticipation of the coming 6G era. To date, tests of a jointly developed wireless device have achieved ultra-high-speed 100 Gbps transmissions in the 100 GHz and 300 GHz bands at distances of up to 100 meters.(2) By comparison, 100 Gbps is approximately 20 times faster than the maximum 4.9 Gbps (3) data rate of current 5G networks.
The roles and achievements of the four participating companies are described below.
DOCOMO
After analyzing the wireless system configuration and performance required for 100 GHz telecommunications applications, DOCOMO developed wireless transmission equipment capable of transmitting data rates equivalent to 100 Gbps at a distance of 100 meters.
NTT
Based on research into 300 GHz wireless devices and related equipment such as wideband mixers, NTT developed a top-level wireless device capable of transmitting 100 Gbps per channel at a distance of 100 meters in the 300 GHz band.(1)
NEC
After analyzing a wireless system configuration for telecommunications in the 100 GHz band, NEC developed a multi-element active phased array antenna (APAA) (1) consisting of more than 100 antenna elements.
Fujitsu
After researching compound semiconductor technologies that enable high-output, high-efficiency signal amplification to extend communication range and reduce power consumption in the 100 GHz and 300 GHz bands, Fujitsu achieved the world's highest power efficiency (4) in a high-output amplifier.
In the 6G era, when wireless networks are envisioned supporting diverse applications ranging from ultra-HD video streaming to real-time control in autonomous vehicles, as well as increasing communication demands, high-capacity wireless communication is expected to be achieved by exploiting the abundant bandwidth available in the sub-terahertz band from 100 GHz to 300 GHz. However, compared to 28 GHz and other millimeter bands used in current 5G systems, the much higher frequencies of the sub-terahertz band will require entirely different wireless devices that are now being developed from scratch. To be successful, this effort will need to overcome several key challenges, such as determining the specific performance requirements of wireless devices operating in the sub-terahertz band, and then actually developing such devices.
Going forward, the four companies will continue to conduct extensive R&D into sub-terahertz telecommunications, leveraging each company's strengths in various initiatives to contribute to 6G standardization.
(1) This assumes that as of March 2024, no other entity has announced 1) achievement of 100 Gbps transmission over a distance of 100 meters in the 100 GHz band (according to NEC); 2) achievement of 100 Gbps transmission over a distance of 100 meters in the 300 GHz band (according to NTT); and 3) achievement of an equivalent isotropic radiation power (EIRP) of 50 dBm and a beam steering angle of approximately ±30 degrees using 100 or more APAA elements in the 100 GHz band (according to NEC).
(2) The transmitter and receiver are facing each other in a straight line with no obstacle between them.
(3) Maximum values specified in technical standards, but not representing the actual data rate, provided on a best-effort basis. Actual data rates may vary depending on the communication environment and network congestion.
(4) World's highest efficiency under specific high-power conditions in the 100 GHz and 300 GHz bands, respectively, according to Fujitsu as of March 2024.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/16/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat
04/13/2026 | BoeingBoeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.
Technica USA and DCT Partnership Insights
04/10/2026 | Real Time with... APEX EXPOThis discussion features Jason Perry from Technica and David Bures from DCT Cleaning, highlighting Technica's expansion in PCB fabrication and assembly. DCT, a leader in cleaning solutions, emphasizes the renewed importance of cleaning in modern electronics due to miniaturization. Comprehensive offerings and an innovative approach to achieving optimal cleanliness is revealed.