Team Spirit: IPC's Global Advocacy Team Acting on Your Behalf

Estimated reading time: 1 minute

The once seemingly apolitical world of printed circuits and soldering irons has evolved into the politically engaged electronics manufacturing industry that we know today. This landscape of technology is quickly evolving by intersecting innovation, economics, and politics. It has created a world where circuit boards and microchips meet lobbying efforts and legislative policymaking, and the decisions made in government chambers can profoundly impact the technologies that shape our lives. In this ever-changing environment, IPC has been at the forefront of advancing the collective voice of the industry.

We recognized the growing need for a more robust advocacy team to help navigate this new era of political engagement, both in the United States and Europe. We already feel a difference in establishing relationships with key legislators, bringing awareness to today’s technology trends through forums in Washington, D.C., on advanced packaging and high reliability; partnering with member companies on letters being sent to Congress; and through efforts to bring together OEM, PCB, and EMS supplier C-suite executives to discuss trends and challenges. Adding key members to our advocacy team has made many of these efforts possible.

Richard Cappetto recently joined IPC’s advocacy team as the senior director of North American government relations to spearhead efforts in Washington on behalf of the industry.

“In recent years, there has been a growing recognition of risks associated with the electronics supply chain, and policymakers are engaging with the industry to address the needs of our national security,” Rich says. “With the power to influence everything from healthcare to transportation, the importance of IPC member companies establishing a presence on Capitol Hill cannot be overstated. The decisions by the U.S. government are increasingly shaping the trajectory of our industry.”

To get to know the rest of the advocacy team, read this article that appeared in the Spring 2024 issue of IPC Community.