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The Knowledge Base: Challenges and Considerations of Harsh Environments

02/26/2025 | Mike Konrad -- Column: The Knowledge Base
In today’s rapidly advancing technological landscape, electronic assemblies are increasingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facilities to the extreme temperatures and humidity of outdoor applications, harsh environments present a significant challenge to the reliability of electronic devices. This column explores the key issues impacting electronics reliability in such conditions, including electrochemical migration (ECM), corrosion, and the role of residue tolerance in assembly design. 

INEMI to Kick Off Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap

02/12/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) will host a webinar on February 13, 2025, at 11:00 a.m. EST (5:00 p.m. CST) to initiate the next phase of development for its Sustainable Electronics Roadmap.

INEMI Launches Webinar on Ecological Footprint Minimization for Sustainable Electronics Roadmap

02/05/2025 | iNEMI
Join us for an insightful webinar as INEMI kicks off the development of additional content for the Sustainable Electronics Roadmap, focusing on ecological footprint minimization.

Global Citizenship: Global Citizenship in Environmental Sustainability

01/29/2025 | Tom Yang -- Column: Global Citizenship
Today’s businesses operate across borders to shape economies, communities, and the environment. With this reach comes responsibility. The concept of global citizenship has grown from a philanthropic ideal to a pressing necessity, urging businesses to think beyond profits to minimize their environmental footprint. Companies must enact change by adopting sustainable practices. Global citizenship in business can drive environmental sustainability, offering insights into balancing profit with responsibility, navigating diverse regulations, and building a culture that prioritizes the planet.

iNEMI and MIT Conduct Survey on Optical Adhesives for High-Volume Photonics

01/21/2025 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.
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