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Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain

07/26/2024 | Intel
Intel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general manager of Intel Foundry Manufacturing and Supply Chain organization.

ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI

07/24/2024 | ASMPT
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

BAE Systems to Deliver Advanced Microelectronics to U.S. Defense Industrial Base

07/23/2024 | BUSINESS WIRE
The contract will support the Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project and will be managed by National Security Technology Accelerator (NSTXL).

Taiwanese Association of Companies Visits IMI

07/17/2024 | IMI
The Philippine Trade & Investment Center (PTIC) in Taipei along with 27 delegates from the Taiwanese Association of companies -- Chung-Hua Institution for Economic Research (CIER), Taiwan Smart Electric Bicycle, Association (TSEBA), and Commercial Vehicle Technology Development Association (CVTDA) visited IMI Philippines last July 10, 2024.

Winners of 2024 IPC Masters Competition China Announced

07/17/2024 | IPC
From July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities.
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