Driving Innovation: Inner Layer Alignment Methods in PCB Production
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
It’s Only Common Sense: Sales as a Team Sport
ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America
April 17, 2024 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is delighted to announce Angela Marquez's appointment as the new Head of the Business Unit for Latin America. Angela Marquez brings a wealth of expertise and insight to her new role. Before joining our team, Angela served as the Business Unit Director for LATAM at Actnano, Inc., where she exhibited exceptional leadership in driving business growth and fostering strategic partnerships.
With an impressive academic background, Angela holds a Master of Business Administration from Nova Southeastern University and a Bachelor of Economics from Pontificia Universidad Javeriana. Her blend of academic achievements and practical experience makes her a formidable leader ready to spearhead ZESTRON's initiatives in the Latin American market.
Angela will collaborate closely with our dedicated ZESTRON Mexico team in her new capacity to bolster support and drive expansion initiatives across the dynamic Latin American market. Her profound understanding of regional dynamics and unwavering commitment to customer satisfaction perfectly align with ZESTRON's vision for growth and excellence.
"I am incredibly excited to join the ZESTRON family and contribute to driving business growth across Latin America,” says Angela. “With ZESTRON's unwavering commitment to excellence and innovation, I am confident that together, we will achieve remarkable success and deliver exceptional value to our regional customers."
Angela's appointment reinforces ZESTRON's dedication to delivering cutting-edge solutions and unparalleled service to clients in Latin America. With her leadership, ZESTRON is poised to seize exciting opportunities and set new benchmarks for regional success.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
07/28/2025 | I-Connect007In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
07/09/2025 | Happy Holden -- Column: Happy’s Tech TalkWhen we consider via reliability, the major contributing factors are typically processing deviations. These can be subtle and not always visible. One particularly insightful column was by Mike Carano, “Causes of Plating Voids, Pre-electroless Copper,” where he outlined some of the possible causes of hole defects for both plated through-hole (PTH) and blind vias.