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Suggested Items

Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies

10/24/2024 |  Rich DePoto, Uyemura
In this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.

MKS’ Atotech and ESI to Participate at TPCA Show & IMPACT Conference 2024

10/23/2024 | MKS Instruments, Inc.
MKS Instruments, Inc., a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (laser systems) and Atotech (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 25th Taiwan Circuit Board Industry International Exhibition 2024 to be held at the Taipei Nangang Exhibition Center from 23-25 October 2024.

Connect the Dots: Designing for Reality—Pattern Plating

10/16/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.

Marcy’s Musings: Destination Metallization

10/17/2024 | Marcy LaRont -- Column: Marcy's Musings
To reach your intended destination, you must have some form of pathway or route upon which to travel. It is much the same with the metallized traces and features on a printed circuit board. They are how electrical signals and power are carried from one point to another in an electronic device. Copper is the most prevalent metal conductor, but other metals are also used to a lesser degree, including gold, silver, tin, and palladium.

PCB007 Magazine October 2024: Alternate Metallization Processes

10/16/2024 | I-Connect007 Editorial Team
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
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