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Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award
April 17, 2024 | IPCEstimated reading time: 2 minutes
The Dieter Bergman IPC Fellowship award was presented to two IPC volunteers at IPC APEX EXPO 2024. The award recipients have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts. Tiberiu Baranyi and Zhiman Chen were chosen as award recipients as they embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. As part of the award, they bestowed Dieter Bergman Memorial Scholarships to the university or college of their choice.
Tiberiu Baranyi, a technology group manager at Flex, is a valued member of more than 25 IPC standards committees, serving as co-chair on several of them, including 7-31B IPC A-610 Task Group, 5-22A- EU J-STD-001 Task Group,7-31A, D-33A EU IPC-A-600 and IPC 6012 Task Groups, 7-34 EU, and 7-31F WHMA A-620 EU Task Group. He is a member of more than 40 different A-Teams and working groups for IPC and currently serves as Chair of the European Standards Steering Committee and vice-chair of the task group responsible for IPC-9726, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies.
Baranyi has chosen the Politehnica University of Timisoara, Department of Electronics, Telecommunications and Information Technologies as his Dieter Bergman Memorial Scholarship selection.
Zhiman Chen, Zhuzhou CRRC Times Electric Co., Ltd., was also honored for her extensive knowledge and understanding of the industry and the development of standards. Chen participates in the global standardization activities of IPC, IEEE, and ISO/IEC. At IPC, she has served as a two-term member of IPC TAEC-Global, two-term chair of IPC Asian Standards Steering Committee and founding member of IPC’s China Intelligent Manufacturing Steering Committee co-chair of 7-24B, chair of 7-31F-Rail Transit Task Group and is active on many additional task groups.
Chen has also led the development of the first two IPC documents dedicated to rail transit: IPC-A-610GRail and IPC/WHMA-A-620CRail; guided the successful launch of new standards in advanced packaging: IPC-6921 for IC substrates, IPC-6931 for optical modules, and IPC-9541 for systems in package; and is dedicated to providing expertise for IPC webinars, and IPC EDGE, IPC’s e-learning platform.
Chen is committed to helping IPC Asian members better participate in and contribute to IPC’s global standardization and networks with leading players in industries and supply chains, enhancing influencer engagement, and promoting industrial associations, forums, and summits. In June, Chen will serve as a panelist on IPC’s Women in Engineering event, detailing her career journey and offering advice to emerging engineer participants. Chen has chosen Hunan Automotive Engineering Vocational College (HAEVC) to receive the Dieter Bergman Memorial scholarship.
“The recipients of this year’s Dieter Bergman Fellowship award epitomize the spirit of fellowship in leading and working with volunteers from around the world, and we are fortunate that they have chosen to share their considerable talent and expertise,” said John W. Mitchell, IPC president and CEO. “We are glad to be able to honor their volunteerism and assist future engineers with this award.”
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.