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Elementary, Mr. Watson: Ensuring Design Integrity

03/28/2024 | John Watson -- Column: Elementary, Mr. Watson
Back in February, many of us watched the "Big Game." It reminded me of the saying, “It's not how you start that is important, but rather how you finish." It is perfectly okay when you are talking about sports, you get off to a bad first half and need to recover in the second half. However, when it comes to PCB design, this is not a good practice. If things start badly, they usually don't recover. They continue down that same path, costing more money and losing design time.  

CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24

03/26/2024 | CentraTEQ
Environmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.

IPC APEX EXPO 2024: A Preview of the Women in Electronics Reception

03/18/2024 | Alicia Balonek, IPC
This year’s Women in Electronics Reception is scheduled from 6 to 7:30 p.m. Tuesday, April 9. It will feature a panel discussion led by IPC Hall of Famer Karen McConnell, Northrop Grumman, on work-life balance. Panelists include:

Your Thermal Designs Are Inefficient

12/07/2023 | Douglas Brooks, Consultant, and Johannes Adam, ADAM Research
Most designers rely on the trace widths suggested in IPC-2152, the “bible” for calculating high-current trace widths (unless you have read our book). IPC-2152 is the best, most thoroughly researched study of trace currents and temperatures available. But it does have some weaknesses. One weakness is that it (by necessity) studies 6-inch-long traces in isolation. But traces are not all 6 inches long nor in isolation.

Siemens’ New Calibre DesignEnhancer Boosts Samsung Foundry Design Quality and Speeds Time to Market

12/07/2023 | Siemens
Siemens Digital Industries Software announces availability of a new process design kit (PDK) from Samsung Foundry that helps mutual customers boost the reliability, quality and robustness of their next-generation integrated circuit (IC) designs manufactured using the foundry’s latest processes.
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