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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 11, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

This week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.
We start off my must-reads with an article written by our editors that explains what a 50% copper tariff could do to our segment of the industry. Next, Mukesh Vasani explains how he left India as a young man and ended up launching the SMT provider Aimtron in Chicago. Chris Ryder of MKS’ ESI is inaugurating a new I-Connect007 podcast this week, Optimize the InterconnectSM, which aims to look at microvia formation with a set of fresh eyes.
We also have a paper that was presented at the Pan-European Electronics Design Conference in Austria this year, which explains how to mitigate cavity resonances in metal enclosures and help prevent EMI problems. Finally, Michael Hinshaw discusses how Green Circuits became one of the largest contract manufacturers in California, but customers may feel like they’re working with a captive provider.
See you next time!
Trump Copper Tariffs Spark Concern
Published July 10
The tariff situation continues to be an evergreen topic, even though some tariffs have been temporarily put on hold. This week, President Trump announced that he would be imposing a 50% tariff on copper imports, which could have a huge impact on the U.S. PCB manufacturing segment. The I-Connect007 Editorial Team breaks it all down.
Inside Aimtron’s Cross-border EMS Strategy
Published July 8
In this interview, Mukesh Vasani discusses his journey from a small farming village in India to Chicago, where he founded the assembly provider Aimtron. He explains how he turned this family venture into a successful high-reliability SMT company that’s now listed on the stock exchange in India, and he did so without going into debt in the process.
New Podcast Series Launches: Optimize the InterconnectSM
Published July 10
Microvias continue to be problematic for PCB designers and fabricators alike. Maybe it’s time to go back to the fundamentals of microvia development. That’s exactly what Chris Ryder of MKS’ ESI will be focusing on in the new I-Connect007 podcast Optimize the InterconnectSM. Join us for the first episode, as Chris discusses the need to rethink microvia formation strategies from the ground up.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
Published July 8
This article comes to us courtesy of Maria Cuesta-Martin, Victor Martinez, and Vidal Gonzalez Aguado of Würth Elektronik. Presented at the Pan-European Electronics Design Conference in Vienna, Austria, earlier this year, the paper explains how cavity resonances in metal shielding enclosures can be reduced or eliminated, allowing them to be used to protect PCBs from EMI, even at high frequencies. Check it out.
Be the Partner Engineers Can Rely On
Published July 8
Green Circuits is a quick-turn prototype assembly provider that specializes in complex, low-volume milaero and medical electronics. In this interview, CEO Michael Hinshaw explains how the Silicon Valley company became one of the biggest contract manufacturers in California, and perhaps the U.S., and why he wants customers to feel as if they’re dealing with a captive assembly house.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/07/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?
MVTec Opens Sales Office in the Benelux Region
02/19/2025 | MVTecMVTec Software GmbH (www.mvtec.com), a leading international manufacturer for machine vision software, is expanding its presence in the Netherlands, the Flemish part of Belgium, and Luxembourg.
Real Time with... electronica 2024: ICAPE—Localized Manufacturing Strategies and Strategic Acquisitions
11/26/2024 | Real Time with... electronicaPete Starkey interviews Christelle Bonnevie, chief industrial officer at ICAPE Group. Bonnevie summarizes the evolution of the group and the strategy of developing a network of manufacturing facilities outside Asia. She also discusses the recent acquisition of NTW in Japan and explains the mechanism of integrating it into the ICAPE organization.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/15/2024 | Marcy LaRont, I-Connect007We have quite a mix in this week’s must-reads. The November issue of Design007 Magazine was published, and you don’t want to miss Andy Shaughnessy’s column. This week, we also have a discussion of long-flex PCBs with CEE PCB’s Jerome Larez, and we revisit my forward-looking interview with Dr. Evelyne Parmentier of Dyconex. Jim Will gives us an update on the many things that have transpired in his first five months as executive director at USPAE. Finally, Happy Holden’s next installment of Happy’s Tech Talk looks into the weaknesses of CAD drawings by using a famous Escher print as an example. Happy is definitely one of a kind.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.