AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
April 22, 2024 | AIMEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/8717/1378/9512/Dillon_Zhu_AIM.jpg)
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
Dillon Zhu is the Regional Technology Support Manager for AIM Solder in China. He has 20 years of SMT equipment and process experience, including a previous position in process for 8 years at Inventec. Dillon is experienced with PCBA manufacturing processes, including SMT and DIP. He has been with AIM Solder since 2008, solving customer SMT and wave soldering issues and providing timely support.
The abstract for his presentation is as follows:
This presentation explores ultraminiature soldering technology in modern electronics. It begins by defining ultraminiature technology and discussing its critical applications in today’s electronic devices. The development of industry standards in areas where none currently exist is explored as well as the role of advanced techniques in setting new benchmarks.
The distinctive characteristics of ultrafine pastes are compared to standard pastes, including powder size, flux chemistries, viscosity, metal load, and oxidation propensity. Associated products like tacky flux and bumping paste, their roles in ultraminiature assembly, preferred alloys, and specific fluxes are also covered.
Lastly, the presentation addresses necessary adaptations in soldering processes, including process adjustments for ultrafine printing, stencil modifications, and the importance of transfer efficiency, alongside the challenges in placement and reflow.
Suggested Items
Winners of IPC Hand Soldering and Rework Competition at NEPCON Thailand 2024 Announced
07/05/2024 | IPCIn conjunction with NEPCON Thailand 2023, IPC hosted its popular IPC Hand Soldering and Rework Competition in Bangkok, on June 19-22, 2024. The seventh edition of the competition in Thailand welcomed 40 participants from 14 companies.
Technology Days 2024 at Rehm: #opentochange
06/14/2024 | Rehm Thermal Systems“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is crucial to be open to change.
International Promotion of Young Talents – Rehm Thermal Systems Welcomes Dual Students from GIP CEI / ESTI in Redon, France
06/14/2024 | Rehm Thermal SystemsIn order to inspire qualified specialists to work in an industrial company, it is important to present yourself as a sustainable and innovative company with development opportunities:
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2
06/18/2024 | I-Connect007 Editorial TeamLow-temperature solders (LTS) continue to attract serious interest from the electronics industry. These solder alloys enable the use of lower glass transition temperature (Tg) substrates and components due to the lower processing temperature, promote long-term reliability by reducing exposure to thermal excursion, and enable organizations to meet sustainability targets. In this quick-read article are sharing an excerpt from Chapter 1 of the second volume of The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering.
Kunkune Partners with Leading Chinese YIHUA Soldering Equipment Company as an Exclusive Distributor
06/07/2024 | Globe NewswireKunkune Ltd, a prominent name in the UK’s industrial equipment distribution sector, proudly announces its exclusive partnership with YIHUA Soldering Equipment Company, a renowned manufacturer based in China.