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Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper

04/17/2024 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. 

New Book on Low-temperature Soldering Now Available

04/17/2024 | I-Connect007
I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.

Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family With New Synchro 3 Release

04/03/2024 | BUSINESS WIRE
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, releases the Synchro™ 3, a new model in the SELECT® Synchro™ selective soldering equipment family for high-volume printed circuit board assembly applications.

Revolutionizing Precision Soldering: Introducing the iBot-i1/2s by Sasinno Americas

04/02/2024 | Sasinno Americas
Sasinno Americas is pleased to introduce its latest advancement in soldering technology – the iBot-i1/2s. This cutting-edge system redefines precision soldering with groundbreaking features designed to elevate efficiency and performance in electronics manufacturing processes.

Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain

03/28/2024 | Rehm Thermal Systems
Current developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
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