Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Kontron Expands U.S. Defense Manufacturing with VX307H Production in Huntsville

10/26/2026 | Kontron
Kontron, a global leader in IoT and Embedded Computing Technology, today announced the first U.S. production of its rugged VX307H 3U VPX compute platform at Nextek, a Kontron company, in Huntsville, Alabama. Customers can now choose a VX307H built in the USA with Global Components.

Punching Out: How Are the Big Boys Doing Now?

10/26/2026 | Tom Kastner -- Column: Punching Out!
I thought it would be interesting to check in again on what the larger North America-based public companies in the PCB and EMS industry are doing. In general, sales, profits, and stock prices are up, and many are doing smaller, non-core acquisitions. In particular, growth markets include AI infrastructure, defense, and certain areas of healthcare. Here’s a breakdown of some of the largest companies.

STMicroelectronics Simplifies Matter Device Authentication with MatterConnect

10/23/2026 | STMicroelectronics
STMicroelectronics has launched the ST MatterConnect service for securely loading authentication credentials into secure chips used in Matter-compatible smart-home devices.

I-Connect007 Releases New Podcast Episode Exploring the Role of Flexible Circuitry in Consumer Electronics

10/22/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the fourth episode of On the Line With... Qnity: Engineering What’s Next, a six-part podcast series, featuring Bruce Lee, business development and strategy leader, AFT, ICS. In this episode, I-Connect007’s Marcy LaRont explores how advances in flexible circuitry and materials are helping manufacturers meet the growing demands of today's consumer electronics market.

Fujifilm, ePac Flexible Packaging Announce Global Strategic Partnership

10/20/2026 | BUSINESS WIRE
Fujifilm announces a global strategic alliance with ePac Flexible Packaging, an international leader in digitally driven flexible packaging solutions.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in