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Advanced Electronics Packaging Digest

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Siemens Advances AI Chip Lithography with NVIDIA cuLitho

10/15/2026 | Siemens
Siemens announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.

Foxconn Research Institute’s Two Quantum Studies Accepted by FOCS 2026

10/13/2026 | Foxconn
Demonstrating its strong forward-looking R&D capabilities, two fundamental theoretical studies from the Hon Hai Research Institute, under Hon Hai Technology Group (Foxconn), have been accepted by the IEEE Symposium on Foundations of Computer Science (FOCS 2026), universally recognized as the highest distinction in theoretical computer science.

imec Unveils World-First Quantum Dot Qubit Device Using High-NA EUV Lithography

05/20/2026 | Imec
This week, at ITF World, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents a world first: a quantum dot qubit device fabricated using High NA EUV lithography.

Altair, JetZero Join Forces to Propel Aerospace Innovation

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RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research

01/16/2025 | Siemens
Siemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™
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