MKS’ Atotech, ESI to Participate in CPCA Show

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MKS’ Atotech, and ESI will participate in the CPCA Show 2024. The show will be held from May 13 to 15, 2024, at the National Exhibition and Convention Center (Shanghai) and will bring together domestic and international manufacturers in the electronic circuit industry.
The show serves as a platform to promote the exchange of knowledge sharing and explore the latest technologies in the electronic circuit industry, providing valuable insights into the future trends of industrial development. A special area will be dedicated to various aspects of electronics manufacturing, including printed circuit boards, electronic assembly, intelligent manufacturing, environmental protection, water treatment, and clean rooms will be featured.

MKS will showcase its strategic brands, Atotech^® and ESI^®, and present its latest offerings in PCB and package substrate manufacturing. From chemical processes and production systems to auxiliary equipment, lasers, and software solutions, visitors can explore a comprehensive range of products and solutions. These innovations are designed to improve production yield, reliability, and efficiency, ensuring optimal results for manufacturers.

Leveraging its expertise in lasers, optics, motion, process chemistry, and equipment, MKS stands out for its ability to Optimize the Interconnect^SM, a key driver for the coming era of advanced electronics, characterized by enhanced miniaturization and complexity. The Optimize the Interconnect^SM philosophy underscores the company’s distinctive capacity to foster the evolution of cutting-edge solutions in advanced PCB and package substrate manufacturing for its clientele and collaborators. We are deeply committed to enabling new technologies and finer feature dimensions through the integration of MKS’ ESI laser drilling technologies with MKS’ Atotech chemistry and plating equipment.

Dr. James Tsai, Business Director of Greater China, said, “After the merge of Atotech^® and ESI^®, we can offer our customers total solutions by combining our excellent process chemistry, sophisticated PCB production equipment, and precision laser equipment. In addition to our chemicals and equipment, we are also equipped with the best local service teams and technical centers to provide the best support to realize Optimize the Interconnect^SM.

Experts from both brands will be on hand at CPCA booth 8A10 to discuss the latest industry trends and obstacles. Our dedicated team onsite will be on hand to showcase innovative product pairings that include PCB manufacturing equipment (such as wet-to-wet process equipment, laser systems, and auxiliary equipment), chemistry, software, and related services.

Our chemistry show highlights:

InPro^® Pulse TVF: The ideal solution for AR TH filling with the best reliability
Printoganth^® MV TP2: Next-generation electroless copper for fine-line SAP applications
NovaBond^® HF2: Ultra-low roughness bonding enhancement for advanced HDI
PallaBond^®: Direct pure EPAG for high-end circuitry and reliability application

Our equipment highlights for PCB production are:

V-Plate^®: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
New Uniplate^®: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrate manufacturing

On the laser equipment side, promotions include:

CapStone™ Flex PCB laser drill: Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
Geode™ G2 PCB laser drill: Next generation CO2 via drilling for HDI and integrated circuit packaging manufacturing – built to drill the ultimate via

Conference: CPCA Show 2024
Date:   May 13-15, 2024
Booth: 8A10
Venue: National Exhibition and Convention Center (Shanghai)