Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects

11/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.

MKS Instruments Breaks Ground on Super Center Factory in Malaysia

10/25/2024 | Globe Newswire
MKS Instruments, Inc., a global provider of technologies that transform the world, the Malaysian Investment Development Authority (MIDA) and InvestPenang announced that MKS celebrated the groundbreaking ceremony of its super center factory in Penang, Malaysia to support the growing needs of semiconductor equipment for wafer fabrication in the region and globally.

SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan

10/22/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC).

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

SIA Applauds Finalization of First CHIPS Award for Polar Semiconductor

09/30/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in