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SIA Applauds CHIPS Act Incentives for Absolics Project in Georgia

05/30/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and Absolics, an affiliate of the Korea-based SKC.

AIM Solder Joins International Electronics Manufacturing Initiative (iNEMI)

05/29/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials, is proud to announce its membership with the International Electronics Manufacturing Initiative (iNEMI).

High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 

Sondrel Poised to Support the Evolution of Intelligent Cars with Ultra-Complex Chips

04/08/2024 | Sondrel
According to Sondrel, a leading provider of ultra-complex chips, the designing of Software Defined Vehicles (SDVs) is changing the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features.

SIA Applauds CHIPS Act Incentives for Intel Projects

03/20/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Intel Corporation.
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