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March 20, 2025 | PRNewswireEstimated reading time: 1 minute
NextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 10.0 project value is expected to exceed $10 million (including NextFlex investment and performer cost share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex's formation to more than $165 million.
Building from the success of past project calls, PC 10.0 uses broadly defined topics to enable a diverse proposer base, with special emphasis on areas in which hybrid electronics can impact high-priority U.S. manufacturing opportunities and areas of emerging importance within the electronics manufacturing community. PC 10.0 emphasizes projects that focus on solving manufacturing challenges and demonstrate key capabilities enabled by hybrid electronics.
"Since NextFlex was established nearly a decade ago, the institute, its members, and Department of Defense partners have worked together to roadmap and advance hybrid electronics technology and manufacturing through collaborative technical projects. With PC 10, we continue this history of addressing the priorities of the U.S. manufacturing industrial base to strengthen its ability to meet both commercial and defense requirements," said Dr. Scott Miller, NextFlex director of technology.
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