Dan’s Biz Bookshelf: 'A View from the Top: Moving from Success to Significance'
The Chemical Connection: The Practice of Doing Business in Foreign Lands
It’s Only Common Sense: Pricing PCBs? It’s All in Their Heads
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
May 9, 2024 | EMA Design AutomationEstimated reading time: 1 minute
Experiencing challenges with MCAD/ECAD collaboration? Do update and revisions take too long? Are you finding integration issues too late in the design process? Does the fidelity of the ECAD data you receive prevent you from building a full digital prototype of your design before manufacture?
If you answered yes to any of these questions you are not alone. MCAD/ECAD is a significant challenge and pinch point in the overall design process and with increasing product complexity and compressed schedules the challenge is only getting more severe. Fortunately, Cadence & Dassault have partnered to help design teams solve these problems through enhanced integration between the MCAD and ECAD design software.
Learn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
What You Will Learn:
- Common challenges in ECAD/MCAD collaboration and how to overcome them.
- How Cadence & Dassault have partnered to solve these challenges.
- Importance of native integration for MCAD design continuity
- How to effectively collaborate with ECAD on design choices and libraries
- Preview of next generation 3DX cloud connector
May 14th, 2024 @ 2:00pm ET. Register now in the events section of ema-eda.com.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Mouser Electronics Celebrates Its 2025 Best-in-Class Award Winners
10/01/2025 | BUSINESS WIREMouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, is pleased to announce the 2025 recipients of the Mouser Best-in-Class Awards.
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..