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NextFlex Launches $5.3 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Promote Commercialization of Hybrid Electronics

06/10/2024 | BUSINESS WIRE
NextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, today released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 9.0 project value is expected to exceed $11M (including NextFlex investment and performer cost-share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex’s formation to $143M.

iNEMI Publishes Four Roadmap Topics

04/04/2024 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the first roadmap topics in the new iNEMI Roadmap format. Printed circuit boards, sustainable electronics, smart manufacturing, and mmWave materials and test are now available online.

IRDS Emerges as Global Leader for Chips Acts Visions and Programs

12/13/2023 | PRNewswire
The broad utilization of the IEEE International Roadmap for Devices and Systems (IRDS) is influencing the various Chips Acts worldwide. Initiatives in Europe, Japan, and the US are engaging the IRDS roadmap for guidance as their activities develop, said Tom Coughlin, President of IEEE. As part of the ongoing roadmap work, the most recent IRDS publication, the IRDS 2023 Update, is being published online and available publicly.

Emirates Joins UAE-based Research Consortium for Renewable and Advanced Aviation Fuels

11/22/2023 | Emirates
In the UAE Year of Sustainability, and at the 3rd ICAO Conference on Aviation and Alternative Fuels (CAAF/3) was held in Dubai, eight founding entities announced the launch of the “Air-CRAFT” initiative - a UAE based research consortium focused on developing, producing, and scaling sustainable aviation fuel (SAF) technologies.

New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem

10/20/2023 | IPC
IPC, in collaboration with other industry organizations and representatives from academia and government celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.
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