A Potpourri of Design PD Classes
May 14, 2024 | Kelly Dack, I-Connect007Estimated reading time: 2 minutes

What is invention without innovation? What is innovation without capability? What is capability without standards and guidelines? What are standards and guidelines without the design and manufacturing stakeholders who produce them?
Folks say that invention involves the creation of things entirely new, while innovation is the process of improving the creations or finding new ways to use them. This observation holds true in all realms of PCB design. However, PCB designers, seated at PCB design workstations with very powerful CAD tools at hand, often misunderstand the concept of invention. Like a new musician making a lead error in a blues riff will refer to off-color notes as “jazz,” many new PCB designers not checking in with supplier capabilities will consider their work an “invention.”
A mistake is a mistake. DFM is a step in the innovation process, which is a necessary part of design. If new materials or processes do not exist, applying the concept of invention involves long timelines and astronomical financial backing, which must occur in order to reach the goals of a new product concept.
On Sunday, April 7, I attended a “design for” Professional Development session taught by Dale Lee. Presented as a two-part morning and afternoon class, Dale covered some very important DFs: design for manufacture (DFM), design for reliability (DFR), and design for assembly (DFA), referred to holistically as DFX (design for excellence). Lee gave many examples that stressed the importance of following industry standards and guidelines in the design of printed boards and assemblies. He stressed the importance of becoming familiar with common materials, machinery, and processes the PCB industry uses in order to “design for” measured success needed by the industry in order to provide measurable quality, performance, and reliability.
Later that morning, I bounced over to the “Ask the Flexperts” PD sessions featuring Mark Finstad and Nick Koop from TTM. Both innovators in their own rights, this Flexpert tag team was able to cover all aspects of flex and rigid-flex design principles to not only confirm industry-proven design methodology but follow up with tangible, expert, manufacturing stakeholder responses from TTM to illustrate what designers can do to improve their future flex designs. The two generously provided all attendees with a tote ring of flex circuit reference material, which can serve as a tactile guide in determining how flex structures behave mechanically.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Suggested Items
Canadian Circuits Inc. Unveils Rapid Prototype PCB Assembly Service to Accelerate Innovation
05/14/2025 | Canadian Circuits, Inc.Canadian Circuits Inc. (CCI), a leading provider of high-quality, made-in-Canada, Printed Circuit Board (PCB) solutions, is proud to announce the launch of its Prototype PCB Assembly (PCBA) service. This new offering enhances CCI’s commitment to empowering engineers and OEMs by accelerating the journey from concept to product launch with precision and efficiency in electronics manufacturing.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
indie Semiconductor Reports Q1 2025 Results
05/13/2025 | BUSINESS WIREindie Semiconductor, Inc., an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago.
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
05/14/2025 | John Watson -- Column: Elementary, Mr. WatsonI've often been asked, "Can you have a perfect PCB design?" At first blush, it seems like the answer should be yes. After all, if you follow all the rules, double-check your work, and use the right tools, it should be perfect. Right?