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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Real Time with… IPC APEX EXPO 2024: Summit Interconnect: Ready for Challenges of Today and Tomorrow
May 15, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Guest Editor Gabriel Zepeda and John Vaughan, VP of strategic markets for Summit Interconnect, highlight the challenges in the PCB sector, such as the dwindling number of fabricators and the trend towards miniaturization. As John points out, Summit was a founding member of the Printed Circuit Board Association of America, which has grown to 50 member and aims to educate legislators, while funding opportunities support chip operations.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
Suggested Items
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
05/28/2025 | Mike Konrad -- Column: The Knowledge BaseMembership in trade associations like the Surface Mount Technology Association (SMTA) offers substantial benefits that can significantly enhance a professional's career in the electronics manufacturing industry. These advantages encompass extensive networking opportunities, access to specialized technical conferences, and complimentary training programs, all contributing to professional growth and industry recognition.
LSI ADL Technology Leverages IPC Membership for Growth, Training, and Industry Leadership
05/28/2025 | Michelle Te, IPC CommunityWhether attending the EMS Leadership Summit at IPC APEX EXPO, or subscribing to workforce training, LSI ADL Technology has noted several positive changes directly related to its IPC membership. “Collaboration, brainstorming, and sharing best practices have been the most important aspects of our partnership with IPC,” says Jonathan Verity, assistant general manager at LSI ADL Technology.
Recognizing IPC Scholarships, Awards, and Opportunities
05/21/2025 | Charlene Gunter du Plessis, IPC Education FoundationThere was no better way to end our year in 2024 than by recognizing hard-working and driven students and educators for their involvement and interests in the electronics manufacturing industry. Through the IPC Scholarship and Awards program, we can help students invest in their future and reward their hardworking and dedicated accomplishments.
Libra Industries Joins the National Association of Manufacturers (NAM) to Advance American Manufacturing
04/29/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is pleased to announce its new membership with the National Association of Manufacturers (NAM), the largest and most influential manufacturing trade association in the United States.