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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
July 28, 2025 | I-Connect007Estimated reading time: Less than a minute
The Optimize the InterconnectSM podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the InterconnectSM is gaining traction across the industry.
This engaging series explores how MKS’ ESI is redefining microvia formation to meet the challenges of today’s most advanced HDI PCB and substrate designs.
In this new episode, “OTI: Why It Matters,” Ryder explores why industry leaders are adopting this unified approach to increase efficiency and reliability in design and manufacturing.
The podcast series is complemented by a newly released companion guide, which provides engineering teams with a technical deep dive into the unified via formation methodology, including case studies that highlight the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!
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Rachael Temple - AlltematedSuggested Items
Zuken Opens New E3.series Development Center
08/29/2025 | ZukenZuken is relocating the E3.series development team to a new, state-of-the-art facility in Neu-Ulm. Effective September 1, 2025, the new headquarters will be located at Meininger Allee 5, 89231 Neu-Ulm.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
Airbus-built MetOp-SG Weather and Climate Satellite Shipped to Kourou
06/06/2025 | AirbusReady for launch - the first of the Airbus-built MetOp-SG weather and climate monitoring satellites left Toulouse cleanrooms a few days ago and is now en-route for Kourou, French Guiana onboard the “Canopée” transport ship.
Bourns Releases Two Compact NTC Thermistor Series Offering High-Precision Temperature Sensing and Compensation
06/05/2025 | BournsBourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, announced its BTN02G and BTN04G Series SMD Negative Temperature Coefficient (NTC) Thermistors.
Bourns Introduces Line Filter Series with Ferrite Toroid Core that Delivers High Impedance Over a Broad Frequency Range
05/30/2025 | BournsBourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced a new filter series designed with a ferrite toroid core. Bourns specifically engineered its SRF1360 line filters to deliver high impedance over a broad frequency range.