-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect
May 22, 2024 | Solder ChemistryEstimated reading time: 1 minute
Solder Chemistry, a trusted brand for over 30 years now powered by Indium Corporation, will feature its complete suite of services for PCBA as part of the prestigious Fraunhofer Future Packaging Production Line exhibition at SMTconnect, June 11-13, in Nuremberg, Germany. Celebrating its 30th anniversary in 2024, Solder Chemistry is committed to maintaining its flexible, customer-oriented structure to deliver the same quality, innovation, and customer satisfaction for which it has become renowned.
Organized by the Fraunhofer IZM, the live production line is an industry-renowned collaboration among various equipment manufacturers, material providers, component suppliers, and research institutes. Inaugurated in 1997, the 26th edition of the joint effort will examine how a higher degree of digitalization and automation can make production processes more robust and responsive to disruptions and external influences.
The exhibition provides visitors with an invaluable opportunity to find customizable solutions for their unique production challenges. In addition to one-on-one discussions, technology breakfasts, and consultation hours, line tours are offered three times daily in both English and German throughout the show.
Solder Chemistry’s BLF083, a lead-free, no-clean paste designed for excellent soldering results with a wide range of process conditions, will be featured on the Future Packaging production line. BLF083 offers outstanding low-voiding, slump, and solder beading resistance, as well as high-temperature stability, long-term processing and standing time. BLF083 paste delivers:
- Low-voiding performance
- Excellent low-to medium-speed printing
- High tackiness
- Good response-to-pause
- Low beading
- Clear residue
- Easy cleanability
“It is an honor for Solder Chemistry’s BLF083 to be featured on the Fraunhofer line at SMTconnect,” said Werner Wagner, General Manager Indium Advanced Materials GmbH.
“The line is a highlight of the show and provides an invaluable opportunity for attendees to interact with cutting-edge manufacturing processes and technologies in a simulated real-world environment.”
Suggested Items
Boeing Commits to Expand South Carolina Operations
12/20/2024 | BoeingBoeing announced it plans to expand its operations in Charleston County. The company plans to invest $1 billion in infrastructure upgrades at its existing site and create 500 new jobs over the next five years.
High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027
12/20/2024 | TrendForceTrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.
Revolutionizing Inner Layer Registration
12/26/2024 | Marcy LaRont, I-Connect007In this interview with Anthony (Tony) Faraci, founder and president of DIS, we delve into enhancing inner layer accuracy and yields, pivotal to boosting profitability in the circuit board industry. Tony has extensive experience in the development of tooling technology over the decades, which ultimately led to his founding DIS. From his beginnings at Multiline to tackling the challenges of registration accuracy, Tony's insights clearly lay out the complexities of modern manufacturing and the innovations in shaping the future of inner layer registration.
The Effects of Copper on a Transmission Line
12/23/2024 | Todd Kolmodin, Gardien ServicesAs technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.
RTX's Collins Aerospace Announces Avionics Modernization Program for King Air and Hawker Aircraft
12/17/2024 | RTXCollins Aerospace, an RTX business, has announced a comprehensive avionics upgrade and modernization program for Beechcraft King Air and Hawker aircraft, spanning Collins' Pro Line Fusion® and Pro Line 21™ advanced avionics systems.