CACI Sets Another Distance Record for Optical Communications
May 24, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Using CACI International Inc’s optical communications technology, NASA successfully sent data from its Psyche spacecraft to the Jet Propulsion Laboratory in Southern California, a distance of more than 200 million kilometers, as part of the Deep Space Optical Communications (DSOC) experiment. Additionally, NASA will continue to leverage CACI’s optical technology for DSOC as the range is extended.
“With this latest accomplishment, we have achieved another ‘first for mankind’ milestone with our technology,” said John Mengucci, CACI President and Chief Executive Officer. “Our proven optical technology continues to attain historic milestones in the Optical Communications Terminal (OCT) realm. With more than 25 OCTs currently in low-earth orbit (LEO) for the U.S. government, we have demonstrated space-to-space and space-to-ground optical communications for proliferated LEO applications proving that a U.S.-based company can effectively design and manufacture this technology here at home.”
Recognized as the lowest-risk and most capable U.S. provider and manufacturer of OCTs across a broad spectrum of government customers and original equipment manufacturer (OEM) satellite providers, CACI has demonstrated exceptional performance in mission data transfer, including LEO and other classified implementations that support resilient, high-speed, secure, optical communications as an alternative to traditional radio frequency (RF) links. These innovations further demonstrate the company’s commitment to investing ahead of need in relevant, enduring, and enabling technologies that seamlessly integrate into OEM platforms.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
OKI Develops Tiling Crystal Film Bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
08/15/2025 | BUSINESS WIREOKI has successfully developed Tiling crystal film bonding technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.