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Altair Releases Altair HyperWorks 2025

02/19/2025 | Altair
Altair, a global leader in computational intelligence, is thrilled to announce the release of Altair® HyperWorks® 2025, a best-in-class design and simulation platform for solving the world's most complex engineering challenges.

Kyocera Develops AI-powered 5G Virtualized Base Station for the Telecommunication Infrastructure Market

02/18/2025 | BUSINESS WIRE
Kyocera Corporation announced that it has officially begun the full-scale development of an AI-powered 5G virtualized base station, with plans to commercialize the technology.

Cambridge GaN Devices Secures $32M to Drive Global Growth in Power Semiconductor Industry

02/18/2025 | BUSINESS WIRE
Cambridge GaN Devices (CGD), a leading innovator in gallium nitride (GaN) power devices, has successfully closed a $32 million Series C funding round. The investment was led by a strategic investor with participation from British Patient Capital and supported by existing investors Parkwalk, BGF, Cambridge Innovation Capital (CIC), Foresight Group, and IQ Capital.

Managing Energy Flow with Proper Stackup Design 

02/13/2025 | Andy Shaughnessy, Design007
At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly. 

Infineon Reaches Next Milestone on 200 mm SiC Roadmap

02/13/2025 | Infineon
Infineon Technologies AG has made significant progress on its 200 mm silicon carbide (SiC) roadmap. The company will already release the first products based on the advanced 200 mm SiC technology to customers in Q1 2025.
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