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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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SEMICON Southeast Asia 2024 Opens Today With Global Supply Chain Resilience, Sustainability, Smart Manufacturing, Talent in Focus
May 28, 2024 | SEMIEstimated reading time: 2 minutes
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development. Registration is open for the May 28-30 exhibition and conferences.
With the Southeast Asia semiconductor sector attracting growing worldwide investments as more regions diversify their supply chains, SEMICON Southeast Asia has seen an exponential expansion in attendance. More than 500 companies are exhibiting at over 1,000 booths, doubling participation from last year’s exhibition and conference. The growth confirms the rising importance of Southeast Asia's semiconductor sector and the critical role of SEMICON Southeast Asia in bringing together industry stakeholders to uncover new innovation and growth opportunities.
Accounting for US$200 billion in chip exports, Southeast Asia boasts growing manufacturing capabilities, supporting government policies and a strong pool of skilled workers.
“Southeast Asia is well-positioned to help accelerate the semiconductor industry’s unprecedented growth driven in part by game-changing innovations such as GenAI," said SEMI President and CEO Ajit Manocha. “With the diversification of supply chains afoot, the region’s skilled workforce, robust infrastructure and rising foreign direct investment are positioning it to become a critical hub in the global chip ecosystem. We’re excited to host key industry stakeholders as they come together at SEMICON Southeast 2024 to drive the sector forward.”
SEMICON Southeast Asia 2024 Highlights
- Regional pavilions from leading semiconductor regions such as China, Europe, Malaysia, Netherlands, Korea, Singapore, Taiwan and Southeast Asia
- New programmes such as the Regional Human Resource Forum, Tech IDOL Competition, Malaysia Sourcing Pavilion, Chiplet and Heterogeneous Integration Summit, and INVEST@Southeast Asia. Two new roundtable discussions – Forging Forward: Strengthening Malaysia's Position in the Global E&E Value Chain and COLLABORATE@Southeast Asia.
- Diverse forums focusing on Market and Industry Trends, Sustainability, Chiplet and Heterogeneous Integration Summit, Advanced Product Testing Forum, and Smart Initiatives such as Smart MedTech, Smart Mobility, and Smart Enterprise
- CxO Summit themed Boosting Agility and Resiliency of the Global Electronics Supply Chain in Southeast Asia
- Workforce development featuring a career fair and expert presentations
- Industry Gala Night for attendees to connect with industry leaders and experts and network to establish new connections
- Prestigious Industry Leader Award and Emerging Young Leader Award
SEMICON Southeast Asia 2024 is made possible by strategic partnerships with the Invest Selangor, Malaysia External Trade Development Corporation (MATRADE), Ministry of Investment, Trade and Industry (MITI) and Malaysian Investment Development Authority (MIDA).
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PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
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