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KLA Completes First Phase of US$200 Million Singapore Operations Expansion

10/04/2024 | KLA
KLA, a world leader in developing industry-leading equipment and services that advance innovation throughout the electronics industry, today celebrated the completion of Phase 1 of its newest manufacturing facility.

TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation

10/04/2024 | TAIFLEX Scientific Co. Ltd
Tazmo Co., Ltd. and TAIFLEX Co., Ltd.  held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei.

RTX to Develop Ultra-wide Bandgap Semiconductors for DARPA

10/03/2024 | RTX
Raytheon, an RTX business, has been awarded a three-year, two-phase contract from DARPA to develop foundational ultra-wide bandgap semiconductors, or UWBGS, based on diamond and aluminum nitride technology that revolutionize semiconductor electronics with increased power delivery and thermal management in sensors and other electronic applications.

Designer's Notebook: Heterogeneous Integration and High-density SiP Technologies

10/03/2024 | Vern Solberg -- Column: Designer's Notebook
Often, our primary goal is to maximize product functionality without increasing product size. Developing a multifunction silicon-based semiconductor (system-on-chip) for a specific product application, however, requires a significant investment in both engineering and financial resources. The problem is that many of the newer generations of semiconductor die have actually increased in size, with higher I/O and terminal pitch variations that have become significantly smaller.

Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024

10/02/2024 | SEMI
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028, SEMI, TECHCET and TechSearch International announced in their latest Global Semiconductor Packaging Materials Outlook (GSPMO) report.
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