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SEMI, IESA Join to Strengthen Semiconductor Ecosystem at SEMICON India 2024

09/12/2024 | SEMI
In a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India. 

Making Waves With Solder Paste Jetting

09/11/2024 | Josh Casper, Horizon Sales
As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.

Register Now for NEDME 2024

09/11/2024 | NEDME
The Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.

Wearable Technology Market to Grow by $87.3 Billion from 2024-2028

09/10/2024 | PRNewswire
Report on how AI is redefining market landscape- The global wearable technology market size is estimated to grow by USD 87.3 billion from 2024-2028, according to Technavio.

Tata Electronics, ASMPT Partner for India Semiconductor Growth

09/10/2024 | PRNewswire
In a significant step towards accelerating its readiness for its semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics signs a Memorandum of Understanding (MOU) with ASMPT Singapore to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
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